Dynamical solidification behaviors and microstructural evolution during vibrating wavelike sloping plate process
Dynamical solidification behaviors and microstructural evolution during vibrating wavelike sloping plate process
复制标题
振动波状斜板过程中的动态凝固行为和微观结构演化
DOI：
10.1016/j.jmatprotec.2008.06.007
复制
发表时间：
2009-03
影响因子：
6.3
通讯作者：
Ren Guo. Guan
中科院分区：
文献类型：
--
作者：
Fu Rong Cao;Li Qing Chen;Jian Ping Li;Chao Wang;Ren Guo. Guan
提出了一种振动波浪式斜板工艺。研究了热转变、溶质转变、形核机制、晶粒长大和组织演变。结果表明，斜板能提供较强的过冷度，斜板表面出现大量异质核，波状流动和振动使异质核从板上逸出，导致异质核增殖。此外，波状流动和振动提高了溶质扩散系数，产生了均匀的溶质和温度场，导致喷发成核。晶粒的生长有两种典型的方式，直接球状生长和枝晶生长。在相对均匀的温度和溶质场条件下，部分颗粒能够保持稳定的生长面，并与圆形表面一起继续生长，最终保持球状结构。然而，总有一些颗粒沿一定的择优方向生长，但在波状流动和振动的作用下，其树枝状臂断裂并转变为近球形结构。在铸造过程中，观察到了从球状/枝晶组织到球状/等轴组织再到球状组织的演变过程。
A vibrating wavelike sloping plate process (VWSP) was proposed. Heat and solute transformations, nucleation mechanism and grain growth as well as microstructure evolution were investigated. It is shown that the sloping plate can provide strong undercooling, and a large quantity of heterogonous nuclei appear on the sloping plate surface, wavelike flow and vibration can enable heterogonous nucleus to escape off the plate, which lead to nucleus multiplication. Moreover, wavelike flow and vibration improve solute diffusion coefficient and cause uniform solute and temperature field, which lead to eruptive nucleation. Grain growth has two typical ways, direct globular growth and dendritic growth. Under relative uniform temperature and solute fields, some grains can keep stable growth surface, go on growing with the round surface and finally maintain their globular structure. However, there are always some grains that grow along a certain preferred direction, but under wavelike flow and vibration their dendritic arms break and transform into near spherical structure. During the casting process, microstructural evolution from globular/dendritic structure to globular/equiaxed structure and to globular structure was observed.
登录
查看更多内容
影响因子：
4.4
作者：
Z. Fan
通讯作者：
Z. Fan
影响因子：
1.8
作者：
R. Guan;C. Wang;Z. Xing;Chun‐Sing Lee;Frank Y. Hu
通讯作者：
R. Guan;C. Wang;Z. Xing;Chun‐Sing Lee;Frank Y. Hu
DOI：
10.1007/bf02651227
发表时间：
1991-06-01
期刊：
METALLURGICAL TRANSACTIONS B-PROCESS METALLURGY
影响因子：
--
作者：
FLEMINGS, MC
通讯作者：
FLEMINGS, MC
影响因子：
4.5
作者：
S. Ji
通讯作者：
S. Ji
影响因子：
6.3
作者：
T. Haga
通讯作者：
T. Haga