Dynamic stress intensity factor for periodic interfacial cracks in a bi-material half space disturbed by SH waves
Dynamic stress intensity factor for periodic interfacial cracks in a bi-material half space disturbed by SH waves
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DOI：
10.1080/09205071.2022.2106901
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发表时间：
2022-08
影响因子：
1.3
通讯作者：
Jie Yang;Shenling Liu;Yue Liu;Bin Yang
中科院分区：
文献类型：
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作者：
Jie Yang;Shenling Liu;Yue Liu;Bin Yang
利用复变函数和绿色函数方法研究了双材料半空间中Ⅲ型界面共线周期裂纹的动力反平面特性。求解了矩形域在面外点源作用下的响应，即求出了所需的绿色函数，并利用“切割”法构造了界面处的周期裂纹。利用界面连续性条件，通过界面“连接”技术，建立了包含面外力系的第一类Fredholm积分方程。推导了裂纹尖端动态应力强度因子的解析表达式。对DSIF进行了数值分析，并对结果进行了深入讨论。
The dynamic anti-plane properties of mode III interfacial collinear periodic cracks in a bi-material half space are investigated by the complex function and Green’s function methods. The responses of a rectangular domain under the action of an out-plane point source are solved, i.e. the required Green’s function is found. Periodic cracks at the interface are constructed by using the “cutting” method. Using the continuity conditions at the bi-material interface, the Fredholm integral equations of the first kind including the out-of-plane force system are established by the interface “conjunction” technique. Analytical expressions for the dynamic stress intensity factors (DSIFs) at crack tips are derived. Numerical analyses of DSIFs are conducted, and results discussed in depth.