Enhanced Autohesive Bonding of Polyetheretherketone (PEEK) for Biomedical Applications Using a Methane/Oxygen Plasma Treatment

Enhanced Autohesive Bonding of Polyetheretherketone (PEEK) for Biomedical Applications Using a Methane/Oxygen Plasma Treatment
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DOI:
10.1002/ppap.201000072
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发表时间:
2010-12-20
影响因子:
3.5
通讯作者:
McKenzie, David R.
McKenzie, David R.
中科院分区:
物理与天体物理3区
文献类型:
--
作者:
Awaja, Firas;Zhang, Shengnan;McKenzie, David R.

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目前认为PEEK等高性能聚合物不适合用于生物医学植入物的封装,部分原因是缺乏坚固耐用的粘合技术。采用甲烷和氧气(CH(4)/O(2))混合气体在RF等离子体中处理,在半结晶PEEK表面之间实现了强自粘合键。表面在高于玻璃化转变温度(T(g))和低于熔点(T(m))的压力下粘合。用CH(4)/O(2)气体处理产生的粘结强度显著高于未处理的样品和仅用CH(4)处理的样品。CH(4)/O(2)等离子体处理产生的表面能的极性分量比未处理表面所观察到的更高,也比单独在CH(4)中等离子体处理的表面所观察到的更高。用CH(4)/O(2)等离子体处理超过3 min的表面的XPS分析表明,沉积的含氧纳米膜含有C-O基团,并且这些膜显示出最高的结合强度。自由基诱导的交联的沉积的纳米膜提出作为一种机制来解释实现的高粘结强度。
High performance polymers such as PEEK are currently considered unsuitable for the encapsulation of biomedical implants, partly because of a lack of a strong and durable bonding technology. Strong autohesive bonds were achieved between semi-crystalline PEEK surfaces using a treatment in RF plasma with a mixture of methane and oxygen (CH(4)/O(2)) gases. The surfaces were bonded under pressure above the glass transition temperature (T(g)) and below the melting point (T(m)). The treatment with CH(4)/O(2) gases produced significantly higher bond strength than untreated samples and samples treated with CH(4) only. The CH(4)/O(2) plasma treatments generated a higher polar component of surface energy than observed for the untreated surfaces and also higher than that observed for surfaces plasma treated in CH(4) alone. XPS analysis of surfaces treated with CH(4)/O(2) plasma for more than 3 min showed that oxygenated nano-films were deposited that contained C-O groups and these showed the highest bonding strength. Free radical induced cross-linking of the deposited nano-film is proposed as a mechanism to explain the high bond strength achieved.