Atomic scale deformation in the solid surface induced by nanoparticle impacts
Atomic scale deformation in the solid surface induced by nanoparticle impacts
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DOI：
10.1088/0957-4484/16/6/041
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发表时间：
2005-06-01
期刊：
影响因子：
3.5
通讯作者：
Wen, SZ
中科院分区：
文献类型：
--
作者：
Xu, J;Luo, JB;Wen, SZ
纳米颗粒对超光滑表面的冲击在纳米加工过程中经常发生，例如单晶硅的抛光，这是半导体制造中的一个重要过程。对纳米粒子撞击固体表面的基本了解对于控制和防止表面变形非常重要。在本研究中，含有去离子水和二氧化硅纳米颗粒的圆柱形液体射流以50m S(-1)的速度倾斜撞击单晶硅表面。用高分辨电子显微镜、原子力显微镜等分析了冲击表面的微观结构，观察到了经30 S辐照后硅片表层的一些晶体缺陷、晶格扭曲、晶粒细化和颗粒旋转。然而，当曝光时间延长到10min时，亚表面出现了一层含有晶体颗粒的非晶层，表面出现了许多凹坑、划痕和原子堆积。
Nanoparticle impacts on an ultra-smooth surface always occur in nano-machining processes, such as polishing of a monocrystalline silicon wafer, which is an important process in the manufacture of semiconductors. A fundamental understanding of nanoparticle impacts on a solid surface is important to control and prevent the deformation of the surface. In this study, a cylindrical liquid jet containing de-ionized water and SiO2 nanoparticles impacts obliquely on a single crystal silicon surface at a speed of 50 m s(-1). The microstructure of the impacted surface was examined using a high resolution transmission electron microscope, an atomic force microscope, etc. Some crystal defects, lattice distortion, grain refinement and rotation of grains in the surface layer of the silicon wafer after exposure for 30 s have been observed. However, when the exposure time is extended to 10 min, an amorphous layer containing crystal grains is exhibited in the subsurface, and many craters, scratches and atom pileups can be found in the surface.