Interconnected CuS nanowalls with rough surfaces grown on nickel foam as high-performance electrodes for supercapacitors
Interconnected CuS nanowalls with rough surfaces grown on nickel foam as high-performance electrodes for supercapacitors
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DOI：
10.1039/c6ra10327h
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发表时间：
2016-06
期刊：
影响因子：
3.9
通讯作者：
Yan Zhang;Jie Xu;Yayun Zheng;Xiaoyan Hu;Yuanyuan Shang;Yingjiu Zhang
中科院分区：
文献类型：
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作者：
Yan Zhang;Jie Xu;Yayun Zheng;Xiaoyan Hu;Yuanyuan Shang;Yingjiu Zhang
在这项研究中，我们开发了一种简便的原位生长工艺，在泡沫镍上制备三维（3D）互连的CuS纳米墙，纳米墙的两侧都有大量的纳米片。该制造路线包括在泡沫镍上替换亚微米尺寸的铜立方体的过程，以及随后通过水热法在泡沫镍上原位生长互连粗糙的CuS纳米墙（RCuS）的过程。 RCuS电极表现出优异的性能，在15 mA cm−2电流密度下比电容为1124 F g−1，在30 mA cm−2电流密度下比电容为912.5 F g−1，具有良好的循环能力（2000次循环后仍保留初始比电容的90.7%），远高于通过简单水热（HCuS）获得的CuS电极，采用铜 二氯化物作为铜源。优异的电化学性能可能归因于高电导率、大比表面积以及纳米墙与泡沫镍之间的牢固结合。 CuS 纳米墙所表现出的高比容量和卓越的倍率性能，再加上泡沫镍基材的灵活性，使 3D 纳米结构电极非常适合低成本、高性能超级电容器。
In this study, we have developed a facile in situ growth process to prepare three-dimensional (3D) interconnected CuS nanowalls on Ni foam, which have a large number of nanosheets on both sides of the nanowalls. The fabrication route contains the replacement process of Cu submicrometer-sized cubes on Ni foam and subsequent in situ growth process of interconnected rough CuS nanowalls (RCuS) on Ni foam via a hydrothermal method. The RCuS electrode displays excellent performance, demonstrating a specific capacitance of 1124 F g−1 at a current density of 15 mA cm−2 and 912.5 F g−1 at 30 mA cm−2 with a good cycling ability (∼90.7% of the initial specific capacitance remained after 2000 cycles), which is much higher than that of the CuS electrode through a simple hydrothermal (HCuS), taking copper dichloride as the copper source. The excellent electrochemical performance may be attributed to the high conductivity, large specific surface, and strong bonding between nanowalls and the Ni foam. The demonstrated high specific capacity and remarkable rate performance of the CuS nanowalls, together with the flexibility of the nickel foam substrate, make the 3D nanostructured electrode ideally suited for low-cost, high-performance supercapacitors.