Creep in a palladium-enriched high-copper amalgam.
Creep in a palladium-enriched high-copper amalgam.
复制标题
在富含钯的高铜汞合金中蠕变。
DOI:
10.1016/0142-9612(88)90086-5
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发表时间:
1988
期刊:
影响因子:
14
通讯作者:
Lin,JH
中科院分区:
文献类型:
--
作者:
Greener,EH;Chung,KH;Lin,JH
Palladium additions to a dispersed phase high-copper amalgam have been shown recently to suppress markedly the η′(Cu 6 Sn 5) concentration and decrease creep. A detailed study of the dental and 24 h creep for Pd containing high-copper amalgams and six commercial controls as a function of applied temperature and stress was performed. One part of Ag-Cu or Ag-Cu-Pd dispersants with substitutions of up to 20 wt 0 Pd for either Ag or Cu was blended with two parts of traditional amalgam alloy. Various temperatures from 25 to 60° C and stresses from 36 to 72 MPa were applied to the samples during the test. For commercial controls and experimental amalgams with no Pd, creep is a strong function of temperature and stress. The experimental amalgam containing up to 10 wt 0 Pd, Pd substituted for Ag, demonstrated essentially constant creep over the temperature and stress range applied.
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DOI:
--
发表时间:
1984
期刊:
The Journal of biological chemistry
影响因子:
--
作者:
Murray,KJ;El-Maghrabi,MR;Kountz,PD;Lukas,TJ;Soderling,TR;Pilkis,SJ
通讯作者:
Pilkis,SJ
影响因子:
4.8
作者:
D. Newton;M. D. Oldewurtel;M. Krinks;J. Shiloach;C. Klee
通讯作者:
C. Klee
影响因子:
4.8
作者:
D. Hathaway;R. Adelstein;C. Klee
通讯作者:
C. Klee
影响因子:
2.9
作者:
MARSHAK, DR;LUKAS, TJ;WATTERSON, DM
通讯作者:
WATTERSON, DM
DOI:
10.1016/s0021-9258(17)40137-2
发表时间:
1977-07
期刊:
The Journal of biological chemistry
影响因子:
--
作者:
Eliezer;Benjamini;Edwin;-G.;Krebs
通讯作者:
Eliezer;Benjamini;Edwin;-G.;Krebs