Localized Electrochemical Deposition Using Ultra-High Frequency Pulsed Power
Localized Electrochemical Deposition Using Ultra-High Frequency Pulsed Power
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DOI：
10.1016/j.promfg.2019.06.139
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发表时间：
2019
期刊：
影响因子：
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通讯作者：
N. Manukyan;Abishek B. Kamaraj;M. Sundaram
中科院分区：
文献类型：
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作者：
N. Manukyan;Abishek B. Kamaraj;M. Sundaram
在本实验研究中，进行局部电沉积镍柱，以研究脉冲频率、施加电压、脉冲占空比和极间间隙对存款的直径和沉积高度的速率的影响。在局部电沉积过程中的超高频的影响，这还没有被研究用于微电化学增材制造的目的，被记录，并进行进一步的量化的局部化的影响。结果发现，沉积高度的速率随着脉冲频率、施加电压和占空比的增加而增加。至于沉积直径，这是一个衡量的本地化，电极间的间隙被发现没有显着的影响，而与脉冲电压和频率，对于某些参数的平均沉积直径是基本上小于工具电极直径，分别约2/3和1/5的比例。这些发现意味着修改电气工艺参数可以实现高度局部化的电化学沉积，这是电化学增材制造的重要要求。
In this experimental study, localized electrodeposition of nickel pillars was performed to study the effect of pulse frequency, applied voltage, pulsed duty cycle, and the interelectrode gap, on the diameter of the deposit and the rate of deposition height. The effects of ultra-high frequency during the localized electrodeposition process, which have not been studied for micro electrochemical additive manufacturing purposes, are documented and further quantification of the effects of localization was conducted. It was found that the rate of deposition height increased with an increase in the pulse frequency, applied voltage, and duty cycle. As for deposition diameters, which is a measure of the localization, inter electrode gap was found to have no significant effect, while with pulse voltage and frequency, the average deposition diameter for certain parameters was substantially smaller than the tool electrode diameter, by approximate ratios of 2/3 and 1/5 respectively. These findings imply that modifying the electrical process parameters can allow for highly localized electrochemical deposition which is an important requirement for electrochemical additive manufacturing.