Shape optimization of hotspot targeted micro pin fins for heterogeneous integration applications
Shape optimization of hotspot targeted micro pin fins for heterogeneous integration applications
复制标题
用于异构集成应用的热点目标微针鳍的形状优化
DOI：
10.1016/j.ijheatmasstransfer.2022.122897
复制
发表时间：
2022
影响因子：
5.2
通讯作者：
Sammakia, Bahgat
中科院分区：
文献类型：
--
作者：
Fallahtafti, Najmeh;Rangarajan, Srikanth;Hadad, Yaser;Arvin, Charles;Sikka, Kamal;Hoang, Cong Hiep;Mohsenian, Ghazal;Radmard, Vahideh;Schiffres, Scott;Sammakia, Bahgat
在高性能计算（HPC）领域，不断增长的功耗需求使得异构集成（HI）成为下一代计算系统的未来，以维持摩尔定律。HI是指将不同的单独制造的组件组装到单个电子模块上，以增强功能和操作特性。作为HI的结果，下一代电子芯片具有局部热点或核心的区域，如果没有充分冷却，则转化为极高温度的区域。与传统的散热方案相比，热点的缓解需要先进的热管理散热方案。本研究探讨结合冲击射流阵列的液态水和非均匀热点有针对性的微针翅，印刷在芯片上，作为一种潜在的传热增强技术。该结构由4个2 cm × 2 cm的芯片组成（芯片总面积为16 cm 2），每个芯片上有8个热点。在本研究中采用液态水作为冷却剂。使用监督机器学习算法进行了详细的数值参数研究和优化。多目标优化是同时优化热阻和流阻。详细优化的结果表明，热点和背景区域的最佳翅片参数可能有很大不同。最佳针翅结构的最小热阻为0.208 K。cm 2/W（0.013 K/W），约束压降约为10 kPa。
In the field of high-performance computing (HPC), growing power demands makes Heterogeneous Integration (HI) the future of next-generation computing systems to sustain Moore's law. HI refers to the assembly of different separately-manufactured components onto a single electronic module to enhance functionality and operating characteristics. As a consequence of HI, the next generation of electronic chips have regions of localized hotspots or cores, translating to a region of extremely high temperature if not adequately cooled. The mitigation of hotspots demands advanced thermal management cooling schemes compared to the conventional ones. This study investigates the combination of impingement jet array of liquid water and non-uniform hotspot targeted micro pin fins, printed on chips, as a potential heat transfer augmentation technique. The configuration comprises four 2 c m× 2 c m chips (Total chip area is 16 cm 2) with eight hotspots on each. Liquid water is employed as the coolant in the present study. A detailed numerical parametric study and optimization were carried out using a supervised machine learning algorithm. The multi-objective optimization is performed to optimize both the thermal and flow resistances simultaneously. The results from the detailed optimization reveal that optimal fin parameters for the regions of hotspot and background could be significantly different. The optimal pin fin configuration resulted in a minimum thermal resistance of 0.208 K. cm 2/W (0.013 K/W) at a constrained pressure drop of about 10 kPa.