Electrochemical corrosion study of Sn–3Ag–3Cu solder alloy in NaCl solution
Electrochemical corrosion study of Sn–3Ag–3Cu solder alloy in NaCl solution
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DOI：
10.1016/j.electacta.2009.07.030
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发表时间：
2009-12
影响因子：
6.6
通讯作者：
F. Rosalbino;E. Angelini;G. Zanicchi;R. Carlini;R. Marazza
中科院分区：
文献类型：
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作者：
F. Rosalbino;E. Angelini;G. Zanicchi;R. Carlini;R. Marazza
采用动电位极化和阻抗谱法研究了Sn-3Ag-3Cu （at%）合金在0.1M NaCl溶液中的腐蚀行为，并与某些微电子元件和器件封装中使用的Sn-3Ag-0.5Cu （at%）焊料的腐蚀行为进行了比较。采用扫描电镜（SEM）和电子探针微量分析（EPMA）对电化学测试前后的样品进行了表征。结果表明，Sn-3Ag-3Cu合金在NaCl溶液中的耐蚀性优于Sn-3Ag-0.5Cu钎料。在电化学试验后，两种合金表面均检测到锡氧氯化物或氧羟基氯化物的存在。与Sn-3Ag-0.5Cu钎料相比，Sn-3Ag-3Cu合金具有更好的腐蚀性能，这可以归因于腐蚀产物层的粘附性和致密性。
The corrosion behaviour of Sn–3Ag–3Cu (at%) alloy was investigated in 0.1M NaCl solution by potentiodynamic polarization and impedance spectroscopy measurements and compared with that of the Sn–3Ag–0.5Cu (at%) solder employed in the packaging of some microelectronic components and devices. Scanning electron microscopy (SEM) and electron probe microanalysis (EPMA) were used to characterize the samples prior to and after the electrochemical tests. Results showed that in NaCl solution the corrosion resistance of the Sn–3Ag–3Cu alloy was better than that of the Sn–3Ag–0.5Cu solder. The presence of tin oxychlorides or oxyhydroxychlorides was detected at the surface of both alloys investigated after the electrochemical tests. The better corrosion behaviour of the Sn–3Ag–3Cu alloy compared to the Sn–3Ag–0.5Cu solder can be ascribed to a more adherent and compact corrosion products layer.