Investigation of Current Flow Between Turns of NI REBCO Pancake Coil by 2-D Finite-Element Method
Investigation of Current Flow Between Turns of NI REBCO Pancake Coil by 2-D Finite-Element Method
复制标题
利用二维有限元方法研究 NI REBCO 扁平线圈匝间电流
DOI：
10.1109/tasc.2016.2536945
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发表时间：
2016
影响因子：
1.8
通讯作者：
A. Ishiyama
中科院分区：
文献类型：
--
作者：
S. Noguchi;Katsutoshi Monma;H. Igarashi;A. Ishiyama
无绝缘（NI）绕线技术有望改善NI ReBCO煎饼线圈的动态和热稳定性，并提高电流密度。研究NI ReBCO线圈的电磁和热行为对NI ReBCO线圈的发展具有重要意义。通过实验和模拟对NI ReBCO线圈本身的稳定性进行了许多研究。然而，匝间旁路电流的详细行为尚未显示。虽然接触电阻率是通过先前的实验得到的，但它不仅包括接触表面的电阻率，还包括ReBCO胶带的组成部分（即铜稳定剂和哈氏合金衬底）的电阻率。为了研究旁路电流的详细行为，模拟中考虑了真实接触面电阻率。采用二维有限元法模拟了NI ReBCO带横截面上的旁路电流。仿真结果阐明了匝间线圈径向电阻率对匝间接触表面电阻率的影响。此外，还报道了热损失，并提出了一种简单的匝间接触等效电路。
The no-insulation (NI) winding technique for an NI ReBCO pancake coil is expected to improve dynamic and thermal stability and enhance current density. The investigations on electromagnetic and thermal behaviors are important for the development of NI ReBCO coils. Many stability investigations of the NI ReBCO coil itself have been carried out by experiments and simulations. However, the detailed behavior of the bypass current between turns has not been shown. Although contact resistivity was obtained through prior experiment, it included the resistivity of not only contact surface but also the components, i.e., the copper stabilizer and the Hastelloy substrate, of a ReBCO tape. To investigate the detailed bypass current behavior in this paper, the true contact surface resistivity is taken into account in the simulation. The bypass current on the cross section of the NI ReBCO tape is simulated using the two-dimensional finite-element method. From the simulation results, the influence of the coil-radial resistivity between turns on the turn-to-turn contact surface resistivity is clarified. In addition, the heat loss is also reported, and a simple equivalent circuit of the turn-to-turn contact is proposed.