Effect of molybdenum doping on the microstructure, micro-hardness and thermal shock behavior of WKMoTiY alloy
Effect of molybdenum doping on the microstructure, micro-hardness and thermal shock behavior of WKMoTiY alloy
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DOI：
10.1016/j.jallcom.2016.04.027
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发表时间：
2016-09
影响因子：
6.2
通讯作者：
Ye Xiao;Bo Huang;Bo He;Ke Shi;Y. Lian;Xiang Liu;Jun Tang
中科院分区：
文献类型：
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作者：
Ye Xiao;Bo Huang;Bo He;Ke Shi;Y. Lian;Xiang Liu;Jun Tang
采用机械合金化（MA）和放电等离子烧结（SPS）技术对W、K、Mo邦迪粉末进行烧结。四种不同浓度的钼，即，（0，2，5，10）wt%的合金进行了性能研究。分析了试样的显微组织、显微硬度和热震性能。结果表明，钼掺杂可与钨发生机械合金化，并占据钨晶格，导致室温下材料的维氏硬度和热导率相应降低。在钼掺杂样品中，W单键K-2wt%Mo邦迪合金表现出很高的抗热震性。结果表明，在W邦迪合金中适量掺钼，有利于合金的强化和抗热震性能的提高。
Wsingle bondKsingle bondMosingle bondTisingle bondY powder were mechanically alloyed (MA) and then consolidated through spark plasma sintering (SPS). Four different concentrations of molybdenum,i.e., (0, 2, 5, 10) wt%, were applied to investigate the behavior of the alloys. The microstructure, Vickers micro-hardness and thermal shock behavior were analyzed. It is found that the molybdenum doping can mechanically alloy with tungsten and occupy tungsten lattice, which results in a correspondingly decrease of Vickers micro-hardness and thermal conductivity at the room temperature. Among the molybdenum doped samples, Wsingle bondK-2wt% Mosingle bondTisingle bondY alloy displays highly enhanced resistance against thermal shock. It is suggested that appropriate molybdenum doping in Wsingle bondKsingle bondMosingle bondTisingle bondY alloy is beneficial in consolidating and improving its thermal shock resistance.