The EUI instrument on board the Solar Orbiter mission: from breadboard and prototypes to instrument model validation
The EUI instrument on board the Solar Orbiter mission: from breadboard and prototypes to instrument model validation
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DOI：
10.1117/12.924343
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发表时间：
2012-09
影响因子：
6.6
通讯作者：
J. Halain;P. Rochus;E. Renotte;T. Appourchaux;D. Berghmans;L. Harra;U. Schühle;Werner Schmutz;F. Auchere;A. Zhukov;C. Dumesnil;F. Delmotte;T. Kennedy;R. Mercier;D. Pfiffner;L. Rossi;J. Tandy;A. BenMoussa;Phyllis Smith
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文献类型：
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作者：
J. Halain;P. Rochus;E. Renotte;T. Appourchaux;D. Berghmans;L. Harra;U. Schühle;Werner Schmutz;F. Auchere;A. Zhukov;C. Dumesnil;F. Delmotte;T. Kennedy;R. Mercier;D. Pfiffner;L. Rossi;J. Tandy;A. BenMoussa;Phyllis Smith
太阳轨道器任务将探索太阳和它的日球层之间的联系，利用轨道接近太阳0.28天文单位的优势。作为该任务的一部分，极紫外成像仪（EUI）将在极紫外和真空紫外的选定光谱发射线上提供太阳大气的全太阳和高分辨率图像序列。为了在太阳轨道飞行器任务的挑战性约束下实现所需的科学性能，需要进一步发展现有技术。作为该开发的一部分，以及其技术成熟度的一部分，一组关键子系统的面包板和原型已经实现，以改进整个仪器设计。基于面包板和原型结果，描述了EUI仪器的体系结构、主要部件和子系统及其驱动约束和预期性能。还将讨论仪器的验证和确认计划。我们提出了热学和力学模型验证，使用结构热模型（STM）的仪器测试活动，然后是飞行仪表制造和AIT活动之前的其他仪器模型。
The Solar Orbiter mission will explore the connection between the Sun and its heliosphere, taking advantage of an orbit approaching the Sun at 0.28 AU. As part of this mission, the Extreme Ultraviolet Imager (EUI) will provide full-sun and high-resolution image sequences of the solar atmosphere at selected spectral emission lines in the extreme and vacuum ultraviolet. To achieve the required scientific performances under the challenging constraints of the Solar Orbiter mission it was required to further develop existing technologies. As part of this development, and of its maturation of technology readiness, a set of breadboard and prototypes of critical subsystems have thus been realized to improve the overall instrument design. The EUI instrument architecture, its major components and sub-systems are described with their driving constraints and the expected performances based on the breadboard and prototype results. The instrument verification and qualification plan will also be discussed. We present the thermal and mechanical model validation, the instrument test campaign with the structural-thermal model (STM), followed by the other instrument models in advance of the flight instrument manufacturing and AIT campaign.