Building blocks of a flip-chip integrated superconducting quantum processor
Building blocks of a flip-chip integrated superconducting quantum processor
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DOI：
10.1088/2058-9565/ac734b
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发表时间：
2022-07-01
影响因子：
6.7
通讯作者：
Bylander, Jonas
中科院分区：
文献类型：
--
作者：
Kosen, Sandoko;Li, Hang-Xi;Bylander, Jonas
我们已经将单个和耦合超导transmon量子位集成到倒装芯片模块中。每个模块由两个芯片组成一个量子芯片和一个控制芯片，它们被凸点键合在一起。我们证明了时间平均相干时间超过90 μ s，单量子位门的量子数超过99.9%，两个量子位门的量子数超过98.6%。我们还提出了器件的设计方法，并讨论了器件参数的芯片间间距的变化的敏感性。值得注意的是，与我们在单芯片平面电路中的基线最新技术相比，额外的倒装芯片制造步骤不会降低量子位性能。这种集成技术可以扩展到实现在一个模块中容纳数百个量子位的量子处理器，因为它为所有量子位和耦合器提供了足够的输入/输出布线。
We have integrated single and coupled superconducting transmon qubits into flip-chip modules. Each module consists of two chips-one quantum chip and one control chip-that are bump-bonded together. We demonstrate time-averaged coherence times exceeding 90 mu s, single-qubit gate fidelities exceeding 99.9%, and two-qubit gate fidelities above 98.6%. We also present device design methods and discuss the sensitivity of device parameters to variation in interchip spacing. Notably, the additional flip-chip fabrication steps do not degrade the qubit performance compared to our baseline state-of-the-art in single-chip, planar circuits. This integration technique can be extended to the realisation of quantum processors accommodating hundreds of qubits in one module as it offers adequate input/output wiring access to all qubits and couplers.