Plasma surface modification of polyimide for improving adhesion to electroless copper coatings
Plasma surface modification of polyimide for improving adhesion to electroless copper coatings
复制标题
聚酰亚胺的等离子体表面改性可提高化学镀铜涂层的附着力
DOI：
10.1163/156856196x00490
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发表时间：
1996
影响因子：
2.3
通讯作者：
J. Jačiauskienė
中科院分区：
文献类型：
--
作者：
G. Rozovskis;J. Vinkevičius;J. Jačiauskienė
研究了氧等离子体处理聚酰亚胺(PI)薄膜对化学镀铜层附着力以及薄膜表面化学成分和PI表面形貌的影响。等离子体操作参数为 1800 W 正向功率，氧气流量为 300 cm3/min，压力为 200 mTorr。剥离强度随着等离子体处理温度的降低而增加。然而，在较高温度下延长处理时间对粘附力有积极影响。观察到剥离强度的增强与 PI 表面含氧基团含量之间的相关性（使用 XPS 研究）。还观察到等离子蚀刻导致的形态变化，在薄膜表面形成凹坑。凹坑深度为3至6微米，直径为10至200微米。将等离子处理后获得的数据与高锰酸盐碱性溶液中化学蚀刻的结果进行比较显示...
The influences of oxygen plasma treatment of polyimide (PI) films on the adhesion of electroless copper coatings as well as on the chemical composition of the film surface and the PI surface morphology were investigated. The plasma operating parameters were 1800 W forward power with O2 flowing at a rate of 300 cm3/min at a pressure of 200 mTorr. The peel strength increased with decreasing plasma treatment temperature. However, extension of the treatment time at higher temperatures had a positive effect on adhesion. A correlation between the enhancement in peel strength and the content of oxygen-containing groups at the PI surface (investigated using XPS) was observed. A change in the morphology as a result of plasma etching was also observed, in the formation of pits in the film surface. The pits ranged from 3 to 6 μm in depth and the diameter varied from 10 to 200 μm. Comparison of the data obtained after plasma treatment with the results of chemical etching in alkaline solutions of permanganate showed a...