Fast etch recipe creation with automated model-based process optimization

Fast etch recipe creation with automated model-based process optimization
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通过基于模型的自动化工艺优化快速创建蚀刻配方

DOI:
10.1117/12.2583868
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发表时间:
2021
期刊:
Advanced Etch Technology and Process Integration for Nanopatterning X
影响因子:
--
通讯作者:
Chopra, Meghali J.
Chopra, Meghali J.
中科院分区:
--
文献类型:
--
作者:
Ban, Yang;Kearney, Kara;Sundahl, Bryan;Medina, Leandro;Bonnecaze, Roger T.;Chopra, Meghali J.

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提出了一种自动创建和优化多步蚀刻配方的方法。在这里,我们展示了如何自动化的基于模型的工艺优化方法可以减少75%或更多的成本和时间的配方创建相比,传统的实验设计方法。该方法成功的基础是用于模拟该过程并对多维参数空间进行后续分析的降阶物理模型。SandBox Studio™ AI用于自动化模型选择、模型校准和后续流程优化。工艺工程师只需要提供输入堆栈和实验测量,用于模型校准和更新。该方法应用于3D NAND器件的沟道蚀刻的优化。自动选择和校准捕获多步反应的物理和化学的降阶模型。同时自动创建镜像AI模型,以便在大型过程空间中实现几乎即时的预测。AI模型的评估速度要快得多,并用于制作Quilt™,这是多维工艺参数空间中蚀刻性能的2D投影。然后,Quilt™工艺图用于自动确定最佳工艺窗口,以实现目标CD。
A method for automated creation and optimization of multistep etch recipes is presented. Here we demonstrate how an automated model-based process optimization approach can cut the cost and time of recipe creation by 75% or more as compared with traditional experimental design approaches. Underlying the success of the method are reduced-order physics-based models for simulating the process and performing subsequent analysis of the multi-dimensional parameter space. SandBox Studio™ AI is used to automate the model selection, model calibration and subsequent process optimization. The process engineer is only required to provide the incoming stack and experimental measurements for model calibration and updates. The method is applied to the optimization of a channel etch for 3D NAND devices. A reduced-order model that captures the physics and chemistry of the multistep reaction is automatically selected and calibrated. A mirror AI model is simultaneously and automatically created to enable nearly instantaneous predictions across the large process space. The AI model is much faster to evaluate and is used to make a Quilt™, a 2D projection of etch performance in the multidimensional process parameter space. A Quilt™ process map is then used to automatically determine the optimal process window to achieve the target CDs.
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