Design, fabrication, and characterization of bridge-type micro-hotplates with an SU-8 supporting layer for a smart gas sensing system
Design, fabrication, and characterization of bridge-type micro-hotplates with an SU-8 supporting layer for a smart gas sensing system
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DOI：
10.1088/1361-6439/aa556b
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发表时间：
2017-02-01
影响因子：
2.3
通讯作者：
Sawada, K.
中科院分区：
文献类型：
--
作者：
Iwata, T.;Soo, W. P. C.;Sawada, K.
在这项研究中，提出了具有SU-8支撑层的桥式微热板（MHP）用于智能气体传感器。所提出的MHP由面积为140 μ m × 140 μ m的加热膜和33 μ m厚的SU-8层沉积在其桥上组成。基于有限元方法的仿真验证了所提出的MHP具有良好的热隔离性能。成功制备了MHP，并对其性能进行了表征。电流-电压特性表明，在5v电压下，MHP温度可达550℃。MHP的温度是通过加热器电阻的变化来计算的。加热到300摄氏度时，MHP的耗电量约为13.9兆瓦，这与之前研究报告的耗电量相当。此外，在恒定电压下观察到100分钟的稳定运行。MHP的特性表明，它可以用于集成气体传感器的相关应用。
In this study, bridge-type micro-hotplates (MHP) with an SU-8 supporting layer were proposed for smart gas sensor applications. The proposed MHP consisted of a heating membrane with an area of 140 mu m x 140 mu m, and a 33 mu m-thick SU-8 layer deposited on its bridges. Finite element method based simulation confirmed that the proposed MHP displayed good thermal isolation properties. The proposed MHP was successfully fabricated, and the properties of the MHP were characterized. Current-voltage characteristics revealed that the MHP temperature can reach 550 degrees C at 5 V. The temperature of the MHP was calculated from changes in the resistance of the heater. Power consumption of the MHP approximately corresponded to 13.9 mW for heating to 300 degrees C. This was comparable to the power consumption reported in the previous studies. Furthermore, a stable operation under a constant voltage was observed for 100 min. The properties of the MHP indicated that it could potentially be utilized for applications related to integrated gas sensors.