MEMS (Micro-Electro-Mechanical Systems) for Automotive and Consumer Electronics
MEMS (Micro-Electro-Mechanical Systems) for Automotive and Consumer Electronics
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DOI：
10.1007/978-3-642-23096-7_14
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发表时间：
2011
期刊：
影响因子：
--
通讯作者：
J. Marek;U. Gomez
中科院分区：
文献类型：
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作者：
J. Marek;U. Gomez
MEMS传感器在过去二十年中获得了令人印象深刻的广泛应用：（a）ESP：汽车打滑并在没有驾驶员干预的情况下稳定自己（B）自由落体检测：笔记本电脑福尔斯掉到地板上，并通过在撞击前自动停放读/写驱动器头来保护硬盘驱动器。(c)安全气囊：安全气囊在即将发生的汽车碰撞中涉及的驾驶员/乘员撞击方向盘之前点火，从而显着降低身体伤害风险。MEMS传感器检测环境条件，并向电子控制系统提供输入。这些关键的MEMS传感器使系统对人类需求的反应更加智能，精确，并且比人类可能的反应速度快得多。传感器成功的重要先决条件是其尺寸、功能、功耗和成本。传感器开发的这一技术进步是通过微加工实现的。这些工艺的发展是微机电系统（MEMS）工业化大规模生产的突破。除了先进的微机械工艺外，还需要创新和强大的ASIC设计，对电气和机械行为的全面模拟，对封装和机械结构的相互作用（主要是温度和寿命）的深入了解。这是在过去20年中通过密集和成功的开发活动以及数十亿传感器的批量生产经验实现的。本章概述了当前的MEMS技术，其应用和市场份额。MEMS工艺的描述，和MEMS的挑战，相比，标准的IC制造，进行了讨论。MEMS的要求的演变，并显示了MEMS应用的一个简短的调查。介绍了静电除尘系统中最新的惯性传感器的概念，重点介绍了传感元件和评估电路的设计思想，以实现优良的噪声性能。本章最后展望了新兴的MEMS应用，如能量采集器和微型燃料电池。
MEMS sensors gained over the last two decades an impressive width of applications: (a) ESP: A car is skidding and stabilizes itself without driver intervention (b) Free-fall detection: A laptop falls to the floor and protects the hard drive by parking the read/write drive head automatically before impact. (c) Airbag: An airbag fires before the driver/occupant involved in an impending automotive crash impacts the steering wheel, thereby significantly reducing physical injury risk. MEMS sensors are sensing the environmental conditions and are giving input to electronic control systems. These crucial MEMS sensors are making system reactions to human needs more intelligent, precise, and at much faster reaction rates than humanly possible. Important prerequisites for the success of sensors are their size, functionality, power consumption, and costs. This technical progress in sensor development is realized by micro-machining. The development of these processes was the breakthrough to industrial mass-production for micro-electro-mechanical systems (MEMS). Besides leading-edge micromechanical processes, innovative and robust ASIC designs, thorough simulations of the electrical and mechanical behaviour, a deep understanding of the interactions (mainly over temperature and lifetime) of the package and the mechanical structures are needed. This was achieved over the last 20 years by intense and successful development activities combined with the experience of volume production of billions of sensors. This chapter gives an overview of current MEMS technology, its applications and the market share. The MEMS processes are described, and the challenges of MEMS, compared to standard IC fabrication, are discussed. The evolution of MEMS requirements is presented, and a short survey of MEMS applications is shown. Concepts of newest inertial sensors for ESP-systems are given with an emphasis on the design concepts of the sensing element and the evaluation circuit for achieving excellent noise performance. The chapter concludes with an outlook on arising new MEMS applications such as energy harvester and micro fuel cells.