Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy‐based binder

Effect of curing conditions on the electrical properties of isotropic conductive adhesives composed of an epoxy‐based binder
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DOI:
10.1108/09540910610665125
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发表时间:
2006-04
影响因子:
2
通讯作者:
M. Inoue;K. Suganuma
M. Inoue;K. Suganuma
中科院分区:
材料科学2区
文献类型:
--
作者:
M. Inoue;K. Suganuma

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目的:本文研究了由环氧基粘合剂制成的典型各向同性导电粘合剂(ICA)的电性能变化,这些变化是由固化条件的不同引起的。设计/方法/方法-对用于固化ICA的各种过程的现场监测显示,ICA样品的导电性取决于高温固化条件和冷却到玻璃化转变温度(Tg)以下的条件。研究结果-固化后的ICA试样在冷却至环境温度后,其电阻率随转换程度的增加而降低,趋于收敛值,随固化温度的增加而降低。试样的电阻率也随后续退火工艺的不同而显著变化。然而,在高于固化温度的温度下退火后获得的电阻率显然取决于特定的铜…
Purpose – This paper investigates the variations in electrical properties of a typical isotropic conductive adhesive (ICA) made with an epoxy‐based binder that are caused by differences in the curing conditions.Design/methodology/approach – In‐situ monitoring of the various processes that were used to cure the ICA revealed that electrical conduction in the ICA specimens depends on both the high‐temperature curing conditions and the conditions during cooling to temperatures below the glass transition temperature (Tg).Findings – The electrical resistivity of the cured ICA specimens after cooling to ambient temperature decreased with increasing degree of conversion, tending towards a convergence value that decreased with increasing curing temperature. The electrical resistivity of the specimens also varied significantly depending on the subsequent annealing process. However, the electrical resistivity achieved after annealing at temperatures above the curing temperatures clearly depended on the particular cu...