Reactive brazing Cf/SiC to itself and to Mo using the NiPdPtAu-Cr filler alloy
Reactive brazing Cf/SiC to itself and to Mo using the NiPdPtAu-Cr filler alloy
复制标题
DOI：
10.1016/j.jeurceramsoc.2017.05.025
复制
发表时间：
2017-10-01
影响因子：
5.7
通讯作者：
Ren, Hai-Shui
中科院分区：
文献类型：
--
作者：
Li, Wen-Wen;Chen, Bo;Ren, Hai-Shui
提出了一种用于连接C-f/SiC复合材料的NiPdPtAu-Cr钎料。采用座滴法研究了1200 ℃保温30 min时C-f/SiC复合材料的润湿性。在1200 ℃保温10 min的钎焊条件下，室温下C-f/SiC-C-f/SiC接头强度仅为51.7 MPa。然而，当使用Mo层时，C-f/SiC-Mo-C-f/SiC接头强度显著增加，在室温下分别为133.2MPa，在900 ℃下为149.5MPa。在C-f/SiC与Mo的界面处，Mo参与了界面反应，在C-f/SiC表面形成了Cr 3C 2/Mo 2C反应层。接头强度的提高应主要归因于MoNiSi的形成。C-f/SiC-Mo接头强度在室温下为86.9MPa，在900 ℃下为73.7MPa。在900 ℃下进行10次热冲击试验后，C-f/SiC-Mo接头强度仍保持在71.6MPa。(C)2017爱思唯尔有限公司版权所有
The NiPdPtAu-Cr filler alloy was proposed for joining C-f/SiC composites. The wettability on C-f/SiC composite was studied by the sessile drop method at 1200 degrees C for 30 min. Under the brazing condition of 1200 degrees C for 10 min, the C-f/SiC-C-f/SiC joint strength was only 51.7 MPa at room temperature. However, when used a Mo layer, the C-f/SiC-Mo-C-f/SiC joint strength was remarkably increased to 133.2 MPa at room temperature and 149.5 MPa at 900 degrees C, respectively. At the interface between C-f/SiC and Mo, Mo participated in interfacial reactions, with the formation of Cr3C2/Mo2C reaction layers at the C-f/SiC surface. The improvement in the joint strength should be mainly attributed to the formation of MoNiSi. The C-f/SiC-Mo joint strength was 86.9 MPa at room temperature and 73.7 MPa at 900 degrees C, respectively. After 10 cycles of thermal shock test at 900 degrees C the C-f/SiC-Mo joint strength of 71.6 MPa was still maintained. (C) 2017 Elsevier Ltd. All rights reserved.