A New Negative-Type Photosensitive Polyimide Based on Poly(hydroxyimide), a Cross-Linker, and a Photoacid Generator
A New Negative-Type Photosensitive Polyimide Based on Poly(hydroxyimide), a Cross-Linker, and a Photoacid Generator
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基于聚羟基酰亚胺、交联剂和光产酸剂的新型负型光敏聚酰亚胺
DOI：
10.1021/ma9605560
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发表时间：
1996
期刊：
影响因子：
5.5
通讯作者：
Tomonari Nakayama
中科院分区：
文献类型：
--
作者：
M. Ueda;Tomonari Nakayama
以聚羟基酰亚胺（PHI）、2，6-二羟甲基-4-甲基苯酚（BHMP）为交联剂、光生酸剂二苯基碘9，10-二甲氧基蒽-2-磺酸盐（DIAS）为引发剂，合成了一种负性光敏聚酰亚胺。通过4，4 '-六氟亚异丙基双邻苯二甲酸酐和4，4'-二氨基-4 ''-羟基三苯甲烷的开环加成聚合，然后在对二甲苯中热环化制备了PHI。PHI膜显示出优异的UV光透明性。含有70wt%PHI、20wt%BHMP和10wt%DIAS的光敏聚酰亚胺在暴露于365 nm光并在120 °C下后烘烤，随后在40 °C下用2.5%四甲基氢氧化铵水溶液显影时显示出70 mJ/cm 2的灵敏度和3.8的对比度。本文还讨论了图像形成的机理。
A negative working photosensitive polyimide based on poly(hydroxyimide) (PHI), 2,6-bis(hydroxymethyl)-4-methylphenol (BHMP) as cross-linker, and photoacid generator diphenyliodonium 9,10-dimethoxyanthracene-2-sulfonate (DIAS) has been developed. The PHI was prepared by the ring-opening polyaddition of 4,4‘-hexafluoroisopropylidenebis(phthalic anhydride) and 4,4‘-diamino-4‘‘-hydroxytriphenylmethane, followed by thermal cyclization in refluxing xylene. The PHI film showed excellent transparency to UV light. The photosensitive polyimide containing 70 wt % PHI, 20 wt % BHMP, and 10 wt % DIAS showed a sensitivity of 70 mJ/cm2 and a contrast of 3.8 when it was exposed to 365 nm light and postbaked at 120 °C, followed by developing with a 2.5% aqueous tetramethylammonium hydroxide solution at 40 °C. The mechanistic study on the formation of images is also discussed.