Molecular packing and properties of poly(benzoxazole-benzimidazole-imide) copolymers
Molecular packing and properties of poly(benzoxazole-benzimidazole-imide) copolymers
复制标题
聚苯并恶唑-苯并咪唑-酰亚胺共聚物的分子堆积及性能
DOI：
10.1039/c2py20074k
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发表时间：
2012-01-01
影响因子：
4.6
通讯作者：
Gu, Yi
中科院分区：
文献类型：
--
作者：
Zhuang, Yongbing;Liu, Xiangyang;Gu, Yi
新型随机聚（苯唑 - 苯并咪唑 - 酰亚胺）共聚物通过5-氨基-2-（4-氨基苯）苯佐可唑（BOA）和5-氨基-2-的反应通过聚（氨基酸）S合成。氨基苯）苯甲酰唑（BIA），带有3,3'，4,4'-二苯基四羧基Dianhydride（BPDA）。还准备了相应的均匀酰亚胺进行比较。所得的聚酰亚胺具有不同的技术来获得其分子填料和特性。共酰胺膜不仅显示了分子链，高包装系数和低吸收的有序排列，而且还表现出极高的抗拉强度（233.64-325.79 MPa）和模量（5.18-5.75 GPA），而没有任何拉伸。玻璃过渡温度（t（g）S）和5％的共聚酰亚胺的氮气温度分别在339-387摄氏度和573-577摄氏度的范围内。这些聚糖酰亚胺的出色机械和热性能已被验证，主要归因于通过引入苯佐唑部分部分的链链填料的规律性以及通过苯并咪唑部分的结合来增强氢键的规律性。此外，二聚酰亚胺膜还显示出对铜（637.0-960.4 n m（-1））的出色粘附，而没有任何粘附启动子。同时，分子堆积的实验值和特性与预期值的偏差表明，BOA和BIA部分对分子水平上的Copolyimide骨架的合作作用。
Novel random poly(benzoxazole-benzimidazole-imide) copolymers were synthesized via the poly(amic acid)s from the reaction of 5-amino-2-(4-aminobenzene)benzoxazole (BOA) and 5-amino-2-(4-aminobenzene) benzimidazole (BIA) with 3,3',4,4'-biphenyl tetracarboxylic dianhydride (BPDA). The corresponding homopolyimides were also prepared for comparison. The resulting polyimides were characterized by different techniques to obtain their molecular packing and properties. The copolyimide films not only showed ordered arrangement of molecular chains, high packing coefficients and low water absorption, they also exhibited extremely high tensile strength (233.64-325.79 MPa) and modulus (5.18-5.75 GPa) without any stretching. The glass transition temperatures (T(g)s) and 5% weight-loss temperatures in nitrogen of the copolyimides were in the range of 339-387 degrees C and 573-577 degrees C, respectively. The excellent mechanical and thermal properties of these copolyimides have been verified to be mainly attributed to the improving regularity of the interchain packing by the introduction of benzoxazole moieties as well as the enhancement of the hydrogen bonding by the incorporation of benzimidazole moieties. In addition, the copolyimide films also showed excellent adhesion to copper (637.0-960.4 N m(-1)) without any adhesion promoters. Meanwhile, the deviation of the experimental values of the molecular packing and properties from the expected values indicated the cooperative effects of BOA and BIA moieties on the copolyimide backbone at the molecular level.