Correlation between plasma characteristics, morphology, and microstructure of sputtered CuAl alloy films with varied target geometry
Correlation between plasma characteristics, morphology, and microstructure of sputtered CuAl alloy films with varied target geometry
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DOI：
10.1088/2053-1591/acb31a
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发表时间：
2023-01
影响因子：
2.3
通讯作者：
Adie Alwen;A. Hodge
中科院分区：
文献类型：
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作者：
Adie Alwen;A. Hodge
在平面和空心阴极溅射过程中，靶材几何形状对涂层微观结构和形貌的影响与沉积条件、等离子体特性以及薄膜生长的变化相关。通过朗缪尔探针分析，将两种靶材几何形状的溅射等离子体特性作为功率密度和氩气压力的函数进行表征，以确定每种配置下离子密度的变化。然后在低（0.4瓦/平方厘米）和高（1.2瓦/平方厘米）功率密度下合成薄膜，并使用X射线衍射、扫描电子显微镜和电子背散射衍射进行表征，将织构、形貌和微观结构的变化与由靶材几何形状引起的离子密度和溅射沉积条件的变化联系起来。据观察，改变靶材几何形状导致沉积速率、同系温度和离子密度增加三倍以上，这改变了薄膜的形貌和织构，但晶粒尺寸没有显著变化。
The effect of target geometry on coating microstructure and morphology is correlated to changes in deposition conditions, plasma characteristics, and film growth during planar and hollow cathode sputtering. The sputtering plasma properties for the two target geometries were characterized via Langmuir probe analysis as a function of power density and Ar pressure to determine the evolution of ion density for each configuration. Films were then synthesized at the low (0.4 W cm−2) and high (1.2 W cm−2) power densities and characterized using x-ray diffraction, scanning electron microscopy, and electron backscatter diffraction to link changes in texturing, morphology, and microstructure with variations in ion density and sputtering deposition conditions caused by target geometry. It was observed that varying target geometry led to an over threefold increase in deposition rate, homologous temperature, and ion density, which altered the morphology and texture of the film without significant changes to the grain size.