Microstructure evolution of Al2O3/Al2O3 joint brazed with Ag–Cu–Ti + B + TiH2 composite filler
Microstructure evolution of Al2O3/Al2O3 joint brazed with Ag–Cu–Ti + B + TiH2 composite filler
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DOI：
10.1016/j.ceramint.2011.07.005
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发表时间：
2012
影响因子：
5.2
通讯作者：
Minxuan Yang;Tiesong Lin;P. He
中科院分区：
文献类型：
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作者：
Minxuan Yang;Tiesong Lin;P. He
采用Ag-Cu-Ti+B+ TiH 2复合填料，在900°C保温10 min，获得了Al 2 O3/Al 2 O3接头。探讨了钎焊过程中界面的演变机理。研究了Ti和B原子含量对接头组织的影响。结果表明，在Al 2 O3/钎料界面处形成了连续致密的反应层Ti 3（Cu，Al）3 O。Ti（Cu，Al）3 O层附近析出Ti（Cu，Al）3 O。原位合成的TiB晶须均匀分布在Ag基和Cu基固溶体中。复合填料中较高的B粉含量增加了Ti B晶须的含量，但降低了Ti 3（Cu，Al）3 O层的厚度，而较高的TiH 2粉含量使Ti 3（Cu，Al）3 O层增厚。随着TiB晶须含量的增加，Ag和Cu基固溶体变得均匀细小。随着TiH 2含量的增加，Ti（Cu，Al）金属间化合物的含量逐渐增加，并从Al 2 O3侧向钎料中心分布，而Cu基固溶体的含量逐渐减少。
Al2O3/Al2O3joint was achieved using Ag–Cu–Ti+B+TiH2composite fillers at 900°C for 10min. The evolution mechanism of interface during brazing was discussed. Effects of Ti and B atoms content on microstructure of joints were investigated. Results show that a continuous and compact reaction layer Ti3(Cu,Al)3O forms at Al2O3/brazing alloy interface. Ti(Cu,Al) precipitates near Ti3(Cu,Al)3O layer. In situ synthesized TiB whiskers evenly distribute in Ag and Cu based solid solution. The higher content of B powders in composite fillers increases TiB whiskers content, but decreases the thickness of Ti3(Cu,Al)3O layer, while the higher TiH2powders content thickens Ti3(Cu,Al)3O layer. Ag and Cu based solid solutions become uniform and fine with the increasing of TiB whiskers content. Ti(Cu,Al) intermetallics content increase and they gradually distribute from Al2O3side to the central of brazing alloy, but the content of Cu based solid solution decreases when the TiH2content increases.