A Novel Fabrication Technology for Waferlevel Vacuum Packaged Microscanning Mirrors
A Novel Fabrication Technology for Waferlevel Vacuum Packaged Microscanning Mirrors
复制标题
晶圆级真空封装微扫描镜的新型制造技术
DOI：
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发表时间：
2007
期刊：
影响因子：
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通讯作者：
B. Wagner
中科院分区：
文献类型：
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作者：
M. Oldsen;U. Hofmann;H. Quenzer;B. Wagner
本文提出了一种晶圆级气密封装 MEMS 微扫描镜的新型制造技术。这种晶圆级封装能够实现静电驱动谐振扫描仪的真空操作，从而降低所需的驱动电压并增强机械偏转角，即使在谐振频率超过 100 kHz 时也是如此。由于可以创建具有两种不同厚度的有源硅结构，两个几乎独立结构的 30 微米厚外延硅层提供了较高的设计可变性。两个厚外延硅层之间的掩埋隔离互连层能够制造横向馈通，这对于建立气密封装至关重要。具有深达 900 微米腔的结构化玻璃晶圆通过阳极键合在正面密封器件晶圆。 AuSi 共晶键合硅晶圆完成了晶圆级真空封装工艺。
This paper presents a novel fabrication technology for wafer level hermetic encapsulated MEMS micro scanning mirrors. This wafer level package enables vacuum operation of the electrostatically driven resonant scanners reducing the required driving voltage and enhancing the mechanical deflection angle even at resonance frequencies of more than 100 kHz. Two nearly independently structured 30 microns thick epipoly silicon layers offer a high design variability due to the possibility to create active silicon structures with two different thicknesses. A buried isolated interconnection layer between the two thick epipoly silicon layers enables the fabrication of lateral feedthroughs which are vital to set up a hermetic package. A structured glass wafer with up to 900 microns deep cavities seals the device wafer at the front side via anodic bonding. An AuSi-eutectic bonded silicon wafer completes the wafer scale vacuum packaging process.