A 50Gb/s PAM-4 Bi-Directional Plastic Waveguide Link with Carrier Synchronization Using PI-Based Costas Loop
A 50Gb/s PAM-4 Bi-Directional Plastic Waveguide Link with Carrier Synchronization Using PI-Based Costas Loop
复制标题
使用基于 PI 的 Costas 环实现载波同步的 50Gb/s PAM-4 双向塑料波导链路
DOI：
10.1109/isscc42614.2022.9731707
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发表时间：
2022
期刊：
影响因子：
--
通讯作者：
Hyeon
中科院分区：
文献类型：
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作者：
Haihong Song;Hanho Choi;J. Yoo;Hyosup Won;Cheong Min Lee;Huxian Jin;T. Kim;Woohyun Kwon;Kyoohyun Lim;Konan Kwon;Chang;Taeho Kim;Jun;Jake Eu;S. Park;Hyeon
由于网络流量的爆炸性增长，数据中心对更大I/O带宽的需求正在增加。然而，传统的高速互连在功能和经济方面都面临着挑战。铜基电力链路正在显示其因皮肤损耗而导致的关键带宽限制。光纤链路需要为短距离大容量链路中的E/O和O/E转换设备以及芯片到光纤组装支付巨额资本支出。作为一种替代方案，最近的研究表明，塑料波导链路具有固有的低损耗和宽带信道特性，可以作为一种很有前途的解决方案来提供低功率/低成本的高速互连。然而，现有技术已经证明，由于波导[1]-[4]的低限制，以及需要外部本地振荡器(LO)相位调谐[2]-[4]的有限载波同步，仅有单个波导传输。本文介绍了一种采用70 GHz发射机和接收机芯片制作的1M50 Gb/S PAM-4双向载波同步塑料光波导链路。该链路实现了2.8pJ/b/m的FOM，在吞吐量距离和能源效率方面显示了最先进的性能。
The demand for greater I/O bandwidth in data centers is increasing due to the explosive growth of network traffic. However, conventional high-speed interconnects are struggling with the challenges in both functional and economical aspects. Copper-based electrical links are displaying their critical bandwidth limitation caused by skin loss. Optical links require significant capital expenses for the E/O and O/E conversion devices and the chip-to-fiber assembly in short-reach high-volume links. As an alternative, the recent studies present that the plastic waveguide links showing the inherent low-loss and wideband channel characteristics can be a promising solution to provide the power-/cost-efficient high-speed interconnects. However, prior arts have demonstrated only a single waveguide transmission due to the low confinement of the waveguide [1]–[4] and a limited carrier synchronization requiring external local oscillator (LO) phase tuning [2]–[4]. In this paper, we demonstrate a 1m 50Gb/s PAM-4 bi-directional plastic waveguide link with carrier synchronization using 70GHz transmitter (TX) and receiver (RX) ICs in fan-out wafer-level packaging (FOWLP) fabricated in 28nm CMOS. The link achieves an FoM of 2.8pJ/b/m showing state-of-the-art performance in terms of throughput-distance, and energy efficiency.