Integrated simulation tool for quality support in the low-volume high-complexity electronics manufacturing domain
Integrated simulation tool for quality support in the low-volume high-complexity electronics manufacturing domain
复制标题
集成仿真工具，为小批量高复杂性电子制造领域提供质量支持
DOI：
10.1080/00207540802427886
复制
发表时间：
2010
影响因子：
9.2
通讯作者：
Anthony Wilson
中科院分区：
文献类型：
--
作者：
Lina A.M. Huertas Quintero;A. West;D. Velandia;P. Conway;Anthony Wilson
由于普遍的全球压力，小批量高复杂性印刷电路板制造是一个高度动态的领域。在这样一个不断发展的环境中，由制造缺陷引起的质量问题是主要关注的问题。这些缺陷的产生、检测和消除会进一步影响客户的需求。当前在识别和解决质量问题方面的实践有三个主要缺点：(i)所使用的度量标准没有意义；（ii）涉及多个人工操作；（三）没有显著的决策支持。本文提出了一种新的集成仿真工具，用于小批量电子制造的质量支持，克服了这些缺点。仿真工具支持该领域的当前需求，即知识资本化、减少浪费、正确的首次性能和敏捷性，以及该领域的客户需求，即交货时间、成本、质量和可靠性。案例研究的定量结果作为该工具在实际环境中的有用性的证据。结果表明，所研究产品的约80%的非增值成本是由于两种类型的制造缺陷。这个结果是根本原因分析的关键，而不仅仅是基于缺陷数量。
Low-volume high-complexity printed circuit board manufacturing is a highly dynamic domain because of prevailing global pressures. In such an evolving environment, quality issues caused by manufacturing defects are the major concern. The generation, detection and elimination of those defects further impact customer requirements and demands. Current practices in terms of identification and solution of quality issues have three major drawbacks: (i) the metrics used are not meaningful; (ii) several manual operations are involved; and (iii) there is no significant decision support. A novel integrated simulation tool for quality support in low-volume electronics manufacturing that overcomes these weaknesses is presented in this paper. The simulation tool supports current needs in the domain, i.e. knowledge capitalisation, waste reduction, right-first-time performance and agility, as well as the domain customer requirements, i.e. lead time, cost, quality and reliability. Quantitative results from a case study are presented as evidence of the usefulness of the tool in a real context. The results show that the approximately 80% non-value-added cost for the product studied is due to just two types of manufacturing defects. This outcome is key for root cause analysis based not only on defect quantity.