Study on effects of alternating current field to pack boriding of medium carbon steel
Study on effects of alternating current field to pack boriding of medium carbon steel
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交流场对中碳钢包渗硼效果的研究
DOI：
10.1179/1749514814z.000000000106
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发表时间：
2014-08
期刊：
影响因子：
--
通讯作者：
Jian Cheng
中科院分区：
文献类型：
--
作者：
Fei Xie;Jian Cheng
采用交流电场强化固体渗硼技术对中碳钢进行了渗硼处理.为了解交流电场对固体渗硼的影响，研究了渗层的扩散动力学和渗层特性。还采用常规固体渗硼（CPB）进行比较。在873、973、1073和1173 K温度下，以4A的固定电流分别进行了1、2、4和6 h的一系列渗硼。用光学显微镜和X射线衍射分析了钢中硼化物的形貌和类型。通过测量作为时间和温度的函数的渗硼层的平均厚度来分析硼化物生长动力学。ACFEPB病例随时间的增长率与CPB一样呈抛物线特征。确定了硼扩散动力学参数D = D 0 exp（-QR-1 T-1）。 结果表明，活性碳纤维增强了硼在基体中的互扩散。瓦...
AbstractA plain medium carbon steel was borided by alternating current field enhanced pack boriding (ACFEPB). Diffusion kinetics and case characteristics of the borided steel were investigated to understand effects of an alternating current field (ACF) on pack boriding. Conventional pack boriding (CPB) was also employed for comparison. A series of boriding were conducted at temperatures of 873, 973, 1073 and 1173 K for 1, 2, 4 and 6 h, respectively, with a fixed current of 4 A. The morphology and types of borides formed in the steel were investigated by optical microscopy and X-ray diffraction, respectively. Boride growth kinetics was analysed by measuring the average thickness of the boriding case as a function of time and temperature. The growth rate of the ACFEPB case versus time showed the same parabolic character as CPB. The parameters of the boron diffusion kinetics, D = D0exp(−QR−1T −1), have been determined. The results showed that the ACF enhanced inter-diffusion of boron in the substrate. The va...
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中低温直流场加速包渗硼特性及机理
影响因子：
5.4
作者：
Fei Xie;Li Sun;Jianwei Pan
通讯作者：
Jianwei Pan
影响因子：
5.4
作者：
L. G. Yu.;K. Khor;G. Sundararajan
通讯作者：
L. G. Yu.;K. Khor;G. Sundararajan
影响因子：
5.4
作者：
Fan-Shiong Chen;Kuo-liang Wang
通讯作者：
Fan-Shiong Chen;Kuo-liang Wang
影响因子：
5.4
作者：
Anthymidis, KG;Zinoviadis, P;Tsipas, DN
通讯作者：
Tsipas, DN
DOI：
10.1179/1749514812z.00000000022
发表时间：
2012-06
期刊：
International Heat Treatment & Surface Engineering
影响因子：
--
作者：
F. Xie;J. Pan
通讯作者：
F. Xie;J. Pan