Direct Semiconductor Wafer Bonding in Non-Cleanroom Environment: Understanding the Environmental Influences on Bonding
Direct Semiconductor Wafer Bonding in Non-Cleanroom Environment: Understanding the Environmental Influences on Bonding
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DOI：
10.1021/acsaelm.9b00118
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发表时间：
2019-06-01
影响因子：
4.7
通讯作者：
Tanabe, Katsuaki
中科院分区：
文献类型：
--
作者：
Inoue, Ryoichi;Takehara, Nagito;Tanabe, Katsuaki
我们在常规的非洁净室环境中研究了半导体直接晶圆键合，以了解环境对键合特性的影响。系统地研究了表面处理、颗粒密度、键合强度和界面电导率之间的相关性。在我们的研究和条件优化的基础上，我们在常规大气环境中实现了具有高界面机械稳定性和电导率的半导体直接键合，足以满足器件应用。此外，我们展示了使用所开发的键合技术制造和运行太阳能电池，电流路径穿过键合界面。这些结果和相关的技术见解可能有助于低成本、更简单地制造高性能的电学和光学器件。
We investigated semiconductor direct wafer bonding in a regular, non-deanroom environment to understand environmental influences on bonding characteristics. The correlations among surface treatments, particle densities, bonding strengths, and interfacial conductivities were systematically investigated. On the basis of our investigation and condition optimization, we realized direct semiconductor bonding in the regular atmosphere with high interfacial mechanical stabilities and electrical conductivities, sufficient for device applications. Furthermore, we demonstrated fabrication and operation of solar cells using the developed bonding technique, with current paths across the bonded interfaces. These results and related technical insights may be useful for a low-cost, simpler manufacture of high-performance electrical and optical devices.