Effects of diamond particle size on the formation of copper matrix and the thermal transport properties in electrodeposited copper-diamond composite materials
Effects of diamond particle size on the formation of copper matrix and the thermal transport properties in electrodeposited copper-diamond composite materials
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DOI：
10.1016/j.jallcom.2019.03.347
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发表时间：
2019-06-30
影响因子：
6.2
通讯作者：
Erb, Uwe
中科院分区：
文献类型：
--
作者：
Cho, Hai Jun;Yan, Dong;Erb, Uwe
电沉积被认为是金属-金刚石散热器材料的一种经济有效的制造方法。然而，尽管控制界面微观结构至关重要，但迄今为止金属-金刚石界面的形成尚未得到详细解决。在这项研究中，我们电沉积铜-金刚石复合材料，观察到66μm尺寸的金刚石颗粒降低了铜的热导率，而420μm尺寸的金刚石颗粒提高了铜的热导率。微分有效介质(DEM)模型分析表明，当金刚石颗粒尺寸为66μm和420μm时，电沉积铜基体-金刚石界面的热边界电导值分别为1.3MW/m(2)K和3.1MW/m(2)K。这种差异归因于金刚石颗粒附近铜基体的微观结构，这是由颗粒尺寸相关的电流密度分布引起的。这些结果表明，电沉积复合材料中的粒径可以强烈影响金属基体的微观结构。 (C) 2019 Elsevier B.V. 保留所有权利。
Electrodeposition is considered as a cost-effective fabrication method for metal-diamond heat sink materials. However, the formation of the metal-diamond interface has not been addressed in detail to date although controlling the interfacial microstructures is crucial. In this study, we electrodeposited copper-diamond composite materials and observed that 66 mu m sized diamond particles decreased the thermal conductivity of copper whereas 420 mu m sized diamond particles increased the thermal conductivity. The differential effective medium (DEM) model analysis showed that the thermal boundary conductance values at the electrodeposited copper matrix-diamond interface were 1.3 MW/m(2)K and 3.1 MW/m(2)K when the diamond particle sizes were 66 mu m and 420 mu m, respectively. This discrepancy was attributed to the microstructure of the copper matrix in the vicinity of diamond particles, which was caused by particle size dependent current density distribution. These results show that particle size in electrodeposited composite materials can strongly affect the microstructure of the metal matrix. (C) 2019 Elsevier B.V. All rights reserved.