Multi-component microinjection moulding-trends and developments
Multi-component microinjection moulding-trends and developments
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多组分微注射成型趋势和发展
DOI：
10.1007/s00170-009-1985-z
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发表时间：
2010
期刊：
影响因子：
--
通讯作者：
Haußelt
中科院分区：
文献类型：
--
作者：
Piotter;Prokop;Ritzhaupt-Kleissl;Haußelt
随着标准微注塑成型在实际生产中越来越成熟，特殊的变体越来越受到关注。特别是，多组分微注射成型的方法值得一提：由于处理和组装是困难的过程，特别是在微技术中，减少安装工作的方法具有很高的经济重要性。通过将成型和安装过程合并在一个步骤中，可以获得经济进步以及新的材料组合。金属（或原则上，陶瓷）微部件制造的一个有趣的方法是插入注射成型和电铸金属沉积的组合。首先，通过导电填充的聚合物的注射成型来生产导电基板。在第二注射成型步骤中，将由绝缘塑料组成的微结构安装在这些板上。准无限的电导率梯度允许仅从基板开始的受控电镀，从而可以实现无缺陷的金属微部件。作为微注射成型的另一种变体，所谓的MicroPIM工艺的发展促进了金属和陶瓷微部件的大规模系列制造技术。与多组分技术相结合，获得了一种有趣的微制造新方法，即通过双组分MicroPIM实现磁性/非磁性或导电/非导电材料组合。但是，不同机械性能的组合，如硬/坚韧配对也是可能的。
With standard microinjection moulding becoming more and more established in practical manufacturing, special variants are attracting increasing attention. Especially, the approaches on multi-component microinjection moulding are worth mentioning: As handling and assembly are difficult procedures especially in microtechnology, methods to reduce mounting efforts are of high economic importance. By merging of shaping and mounting procedures in one step, economic progress as well as new material combinations can be obtained. An interesting approach for the fabrication of metal (or in principal, ceramic) microcomponents is the combination of insert injection moulding and metal deposition by electroforming. First, an electrically conductive base plate is produced by injection moulding of conductively filled polymers. In a second injection moulding step, microstructures consisting of insulating plastics are mounted on these plates. The quasi-infinite conductivity gradient allows controlled electroplating starting at the base plate only so that defect-free metal microcomponents can be achieved. As a further variant of microinjection moulding, the development of the so-called MicroPIM process facilitates a large-scale series fabrication technology for metal and ceramic microcomponents. Combined with multi-component technology, an interesting new approach for micromanufacturing is obtained, i.e. the realisation of magnetic/non-magnetic or conductive/non-conductive material combinations by two-component MicroPIM. But, also the combination of different mechanical properties like hard/tough pairings is possible.