Influences of semiconductor morphology on the mechanical fatigue behavior of flexible organic electronics
Influences of semiconductor morphology on the mechanical fatigue behavior of flexible organic electronics
复制标题
半导体形貌对柔性有机电子机械疲劳行为的影响
DOI：
10.1063/1.4845995
复制
发表时间：
2013
期刊：
影响因子：
--
通讯作者：
Young‐Chang Joo
中科院分区：
文献类型：
--
作者：
Young;Yong Uk Lee;Han;Hae;L. Evans;Young‐Chang Joo
以6，13-二（三异丙基硅基乙炔基）并五苯（TIPS-并五苯）为结晶有机半导体（OSC），聚三芳胺（PTAA）为非晶有机半导体（OSC），研究了结晶形态对OSCs机械疲劳性能的影响.在循环弯曲期间，使用金属-半导体-金属结构上的传输线方法监测OSC的电阻。TIPS-并五苯的电阻在拉伸应力模式下的疲劳损伤下增加，但在PTAA中没有观察到这种降解。两种OSC在压缩弯曲疲劳下均稳定。TIPS-并五苯的畴界处晶间裂纹的形成是拉伸弯曲疲劳下其电性能劣化的原因。
The influence of crystalline morphology on the mechanical fatigue of organic semiconductors (OSCs) was investigated using 6,13-bis(triisopropylsilylethynyl)pentacene (TIPS-pentacene) as a crystalline OSC and poly(triarylamine) (PTAA) as an amorphous OSC. During cyclic bending, resistances of the OSCs were monitored using the transmission-line method on a metal-semiconductor-metal structure. The resistance of the TIPS-pentacene increased under fatigue damage in tensile-stress mode, but no such degradation was observed in the PTAA. Both OSCs were stable under compressive bending fatigue. The formation of intergranular cracks at the domain boundaries of the TIPS-pentacene was responsible for the degradation of its electrical properties under tensile bending fatigue.