Effect of preoxidation on deposition of thin gate-quality silicon oxide film at low temperature by using a sputter-type electron cyclotron resonance plasma
Effect of preoxidation on deposition of thin gate-quality silicon oxide film at low temperature by using a sputter-type electron cyclotron resonance plasma
复制标题
预氧化对溅射型电子回旋共振等离子体低温沉积栅级氧化硅薄膜的影响
DOI:
10.1063/1.366431
复制
发表时间:
1997
影响因子:
3.2
通讯作者:
T. Tsurushima
中科院分区:
文献类型:
--
作者:
D. Gao;Y. Kashiwazaki;K. Muraoka;H. Nakashima;K. Furukawa;Yichun Liu;K. Shibata;T. Tsurushima
We have studied a method of combining preoxidation and subsequent sputter deposition for fabricating Si oxide films with a thickness of less than 10 nm at low temperature by using a sputter-type electron cyclotron resonance plasma system. As a key process to achieving high quality composite oxide structures, plasma preoxidation was investigated under different gas flow rates at a substrate temperature of 130 °C. The optimum conditions for the preoxidation were clarified. The structural properties of Si oxide formed by this method with the preoxidation were characterized and compared with those of Si oxide which was directly sputtered without a preoxidation step. It was found that the method with the preoxidation provided a useful way of establishing an abrupt Si/SiO2 interface region and achieving films which have a lower network disorder degree. This procedure was then followed by a thermal annealing in Ar ambient at 450 °C. A thin Si oxide film was produced with a fixed charge density of less than 1.0×1...