Contact transparency in mechanically assembled 2D material devices
Contact transparency in mechanically assembled 2D material devices
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DOI：
10.1088/2515-7639/ab1863
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发表时间：
2019-06
期刊：
影响因子：
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通讯作者：
S. Mills;N. Mizuno;Peng Wang;J. Lyu;Kenji Watanabe;T. Taniguchi;F. Camino;Liyuan Zhang;Xu Du
中科院分区：
文献类型：
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作者：
S. Mills;N. Mizuno;Peng Wang;J. Lyu;Kenji Watanabe;T. Taniguchi;F. Camino;Liyuan Zhang;Xu Du
二维原子晶体（2DAC）可以精确地机械组装，用于制造异质结构，允许以极大的灵活性组合材料构建块。此外，虽然传统的纳米光刻可能对大多数不具有足够惰性的2DAC是有害的，但机械组装潜在地最小化了纳米纤维加工并保留了2DAC的固有物理特性。在这项工作中，我们研究了各种2DAC和电接触之间的界面电荷输运，通过制造和表征2DAC超导结通过机械转移。与传统的纳米光刻制造的器件相比，机械组装的器件显示出相当或更好的界面透明度。电接触处的表面粗糙度被确定为是界面质量的主要限制。
Two-dimensional atomic crystals (2DACs) can be mechanically assembled with precision for the fabrication of heterostructures, allowing for the combination of material building blocks with great flexibility. In addition, while conventional nanolithography can be detrimental to most of the 2DACs which are not sufficiently inert, mechanical assembly potentially minimizes the nanofabrication processing and preserves the intrinsic physical properties of the 2DACs. In this work we study the interfacial charge transport between various 2DACs and electrical contacts, by fabricating and characterizing 2DAC-superconductor junctions through mechanical transfer. Compared to devices fabricated with conventional nanolithography, mechanically assembled devices show comparable or better interface transparency. Surface roughness at the electrical contacts is identified to be a major limitation to the interface quality.