Comprehensive design guidance for PTH via stub in board-level high speed differential interconnects
Comprehensive design guidance for PTH via stub in board-level high speed differential interconnects
复制标题
板级高速差分互连中 PTH 过孔存根的综合设计指南
DOI：
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发表时间：
2010
期刊：
影响因子：
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通讯作者：
T. Michalka
中科院分区：
文献类型：
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作者：
J. Shin;T. Michalka
电镀通孔（PTH）通孔通常用于在多层PCB的层之间路由垂直信号过渡。众所周知，过孔残端（PTH过孔中不直接参与层过渡的部分）可能对信号完整性产生重大影响，实际上充当带通滤波器，降低设计裕度，甚至可能导致故障。本文讨论通过短截线设计问题，并提供全面的设计指导的基础上，频率和时域的结果。设计指导结果使用市售的3D FEM模拟工具和结果生成。提供的数据显示出良好的相关性之间的模拟和测量的模拟结果的可信度。一个简单的经验法则，估计工作频率范围的安全通过短截线的影响。
A plated-through-hole (PTH) via is commonly used to route vertical signal transitions between layers of a multi-layered PCB. It is well known that a via stub, the portion of the PTH via not directly involved in the layer transition, can have a significant impact on signal integrity, effectively acting as a bandpass filter, degrading the design margin or even potentially causing failures. This paper discusses via stub design issues and provides comprehensive design guidance based on both frequency and time domain results. The design guidance results were generated using a commercially available 3D FEM simulation tool and results. Data showing good correlation between simulation and measurement are provided to lend credence to the simulated results. A simple rule of thumb for estimating an operating frequency range safe from via stub effects is presented.