T.Ohmi: "Large-Electromigration-Resistance Copper Interconnect Technology for Subhalf-micron ULSI'S" Technical Digest,International Electron Devices Meeting 1991,Washington D.C.285-288 (1991)
T.Ohmi: "Large-Electromigration-Resistance Copper Interconnect Technology for Subhalf-micron ULSI'S" Technical Digest,International Electron Devices Meeting 1991,Washington D.C.285-288 (1991)
复制标题
T.Ohmi:“亚半微米 ULSI 的大电迁移铜互连技术”技术文摘,1991 年国际电子器件会议,华盛顿特区 285-288 (1991)
DOI:
--
复制
发表时间:
--
期刊:
影响因子:
--
通讯作者:
中科院分区:
文献类型:
--
作者: