Cu Salt Ink Formulation for Printed Electronics using Photonic Sintering
Cu Salt Ink Formulation for Printed Electronics using Photonic Sintering
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DOI：
10.1021/la402026r
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发表时间：
2013-09-01
期刊：
影响因子：
3.9
通讯作者：
Suganuma, Katsuaki
中科院分区：
文献类型：
--
作者：
Araki, Teppei;Sugahara, Tohru;Suganuma, Katsuaki
基于铜盐（甲酸铜/乙酸铜/油酸铜）的光吸收能力，我们使用高强度脉冲光（HIPL）配制用于光子烧结的铜盐前体油墨。油墨可以通过可控制的晶场分裂状态（即，配体重量和它们在金属中心周围的配位）。油墨的光吸收特性对配体的碳链长度非常敏感，并且油墨颜色可以急剧变化。从C/Cu比与所需烧结能量之间的关系，可以确定积分吸收系数与光子烧结行为强烈相关。这些.结果表明，油墨吸收特性是光烧结中最重要的因素。通过HIPL方法由烧结的甲酸铜络合物油墨形成的线显示出良好的电子传导性，实现了56 × 10（-5）Ω cm的低电阻率。然而，导线的电阻率随着油墨的碳链长度的增加而增加，这表明大量的残余碳对导线的表面形貌和导电性都有负面影响。我们在这项研究中发现，高吸光率和低碳油墨将通过减少能源使用和碳氧化物气体排放来降低未来的环境负荷。
We formulate copper salt (copper formate/acetate/oleate) precursor inks for photonic sintering using high-intensity pulsed light (HIPL) based on the ink's light absorption ability. The inks can be developed through controllable crystal field splitting states (i.e., the ligand weights and their coordination around the metal centers). The inks light absorption properties are extremely sensitive to the carbon chain lengths of the ligands, and the ink colors can drastically change. From the relationship between the ratios of C/Cu and the required sintering energies, it is possible to ascertain that the integral absorbance coefficients are strongly correlated with the photonic sintering behavior. These. results suggest that the ink absorbance properties are the most important factors in photosintering. The wires formed by sintered copper formate complex ink via the HIPL method showed good electronic conduction, achieving a low resistivity of 56 x 10(-5) Omega cm. However, the resistivity of the wires increased with increasing contains carbon chain length of the inks, suggesting that large amounts of residual carbon have negative effects on both the wire's surface morphology and the electrical conductivity. We find in this study that high light absorptivity and low carbon inks would lead to a lower environmental load in future by reducing both energy usage and carbon oxide gas emissions.