A 36-chip multiprocessor multichip module made with the General Electric high density interconnect technology
A 36-chip multiprocessor multichip module made with the General Electric high density interconnect technology
复制标题
采用通用电气高密度互连技术制造的 36 芯片多处理器多芯片模块
DOI：
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发表时间：
1991
期刊：
影响因子：
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通讯作者：
J. Burgess
中科院分区：
文献类型：
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作者：
M. Gdula;K.B. Welles;R.J. Wojnarowski;C. Neugebauer;J. Burgess
一个独特的封装和互连技术被用来建立一个多芯片，四个CPU单元，流水线并行处理计算机模块，使用德州仪器公司的TMS320C25数字信号处理器和配套电路。与采用印刷电路板方法安装的传统芯片封装相比，该技术允许面积减少15倍以上。降低互连电容，消除传统封装寄生效应，使商用40 MHz器件的时钟频率接近90 MHz。<<ETX>>
A unique packaging and interconnect technology was used to build a multichip, four-CPU-element, pipeline parallel processing computer module using Texas Instruments TMS320C25 digital signal processors and companion circuits. The technology allowed a greater than fifteen-fold reduction in area over conventional chip packages mounted with printed circuit board methods. Reduced interconnect capacitance coupled with elimination of conventional package parasitics allowed clocking of commercial 40 MHz parts to nearly 90 MHz.<<ETX>>