Liquid-metal-based phase shifter with reconfigurable EBG filling factor
Liquid-metal-based phase shifter with reconfigurable EBG filling factor
复制标题
具有可重构 EBG 填充因子的液态金属移相器
DOI：
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发表时间：
2015
期刊：
影响因子：
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通讯作者：
W. Shiroma
中科院分区：
文献类型：
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作者：
Jonathan H. Dang;R. C. Gough;Andy M. Morishita;A. Ohta;W. Shiroma
提出了一种在一维电磁带隙（EBG）结构中基于可重构填充因子（FF）的移相器。该器件能够实现不同等级的相移，使用液态金属来填充或疏散微带线有缺陷的接地平面中的孔。该设计由三个级联 EBG 晶格组成，每个晶格由 4 个圆圈组成，FF 分别为 0.17、0.25 和 0.37。启动后，每个元件在 5.6 GHz 时会产生 1.8、5.7 和 9.4 度的相移。总共可以实现 67.2 度的相移，平均插入损耗为 1.1 dB。
A phase shifter based on reconfigurable filling factors (FF) in a 1D electromagnetic bandgap (EBG) structure is presented. The device is capable of different gradations in phase shift, using liquid metal to fill or evacuate holes in the defected ground plane of a microstrip line. The design consists of three cascaded EBG lattices, each consisting of 4 circles with a FF of 0.17, 0.25, and 0.37 respectively. When actuated, a per-element phase shift of 1.8, 5.7, and 9.4 degrees at 5.6 GHz is introduced. A total of 67.2 degrees of phase shift can be achieved with an average insertion loss of 1.1 dB.