Selective noble-metal deposition modulation on photocurable polydimethylsiloxane films for electronics device applications
Selective noble-metal deposition modulation on photocurable polydimethylsiloxane films for electronics device applications
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DOI：
10.1007/s00339-021-04385-0
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发表时间：
2021-03
期刊：
影响因子：
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通讯作者：
T. Tsujioka;Akari Nishimura
中科院分区：
文献类型：
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作者：
T. Tsujioka;Akari Nishimura
在有机表面上的选择性金属气相沉积是一种有趣的现象，并且适用于基于真空蒸发而无需荫罩来制备用于各种电子和光子器件的精细金属图案。然而，对于通常用于电子领域的贵金属如Au、Ag和Cu，使用光致变色二芳基乙烯的选择性金属气相沉积尚未成功。本文报道了贵金属蒸气在光固化聚二甲基硅氧烷（PDMS）薄膜上的沉积调节。当Au、Ag或Cu真空沉积在UV可固化PDMS上时，Au和Cu在表面上甚至在未固化膜上形成膜。然而，Ag从未固化的膜中解吸，并且少量蒸发的Ag原子被吸收到膜中。这种金属物种依赖于金属沉积/解吸倾向与金属物种的固有蒸气压;具有高蒸气压的金属倾向于解吸。具有少量Ag沉积的未固化膜容易用己烷冲洗去除，仅在固化膜上留下Ag。使用该原理，通过用光掩模照射UV光以形成固化图案并使用无掩模Ag沉积来制备各种Ag膜图案。此外，我们成功地制作了精细的银图案的宽度为几个微米的紫外激光扫描和无掩模银气相沉积。该方法适用于各种电子器件的电极/布线。
Selective metal-vapor deposition on organic surfaces is an interesting phenomenon and is applicable to prepare fine metal patterns for various electronic and photonic devices based on vacuum evaporation without a shadow mask. However, selective metal-vapor deposition with photochromic diarylethenes has not been successful for noble metals such as Au, Ag and Cu, which are generally used in the electronics field. In this paper, we report deposition modulation of noble-metal vapor on a photocurable polydimethylsiloxane (PDMS) film. When Au, Ag or Cu was vacuum-deposited on the UV-curable PDMS, Au and Cu formed a film on the surface even on the uncured film. Ag, however, was desorbed from the uncured film, and a small amount of evaporated Ag atoms was absorbed into the film. This metal species dependence on metal-deposition/desorption tendency was correlated with the intrinsic vapor pressure of metal species; metals with a high vapor pressure tend to desorb. The uncured film with a small amount of Ag deposition was easily removed with a hexane rinse, leaving only Ag on the cured film. Using this principle, various Ag-film patterns were prepared by irradiating upon UV light with a photomask to form a cured pattern and using maskless Ag deposition. Furthermore, we succeeded in fabrication of fine Ag patterns with a width of several micron by UV-laser scanning and maskless Ag-vapor deposition. This method would be applied to the electrode/wiring for various electronic devices.