Fabrication and characterization of vacuum plasma sprayed W/Cu-composites for extreme thermal conditions
Fabrication and characterization of vacuum plasma sprayed W/Cu-composites for extreme thermal conditions
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DOI：
10.1007/s10853-006-1039-y
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发表时间：
2007-01
影响因子：
4.5
通讯作者：
G. Pintsuk;I. Smid;J. Döring;W. Hohenauer;J. Linke
中科院分区：
文献类型：
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作者：
G. Pintsuk;I. Smid;J. Döring;W. Hohenauer;J. Linke
钨与铜的结合和对商业上可行的生产技术的不断探索是复合材料领域中具有挑战性的问题之一。这种材料组合之所以至关重要，是因为它能够承受钨侧的侵蚀和高温，以及铜侧的大量热量。由于热膨胀系数和杨氏模数的不匹配，这两种材料的直接连接在界面处产生了高的残余应力和热应力，最终降低了元件的寿命。解决这个问题的一个可能的答案是W和Cu的功能梯度结构，它使材料性质的转变变得平滑。本研究的重点是真空等离子喷涂(120 mm bar，Ar)W/Cu梯度和具有一定混合比的复合材料。研究了制备工艺和钨铜比对材料微观结构的影响，给出了热机械和热物理结果分析的结果。在两种不同的模型几何结构中，用有限元模型验证了梯度对弹性和弹塑性响应的正效应。与W和铜之间的参考界面相比，从纯钨到75%钨的部分梯度显示出最好的结果，并通过降低W/FGM和FGM/Cu两个界面的应力显著提高预期寿命性能。
The joining of tungsten to copper and the ongoing search for commercially viable production techniques is one of the challenging issues in the field of composite materials. The reason why this material combination is of essential importance is its ability to withstand erosion and high temperatures on the tungsten side and to remove big quantities of heat on the copper side. Due to the mismatch of thermal expansion and Young’s moduli, the direct joining of these two materials results in high residual and thermal stresses at the interface, ultimately reducing component lifetime. One potential answer to this problem is functionally graded structures of W and Cu, which smoothen the transition of material properties. The present study focuses on vacuum plasma spraying (120 mbar, Ar) of W/Cu-gradients and composites with defined mixing ratios. The influence of the fabrication process and the W:Cu ratio on the microstructure has been investigated and results from thermo-mechanical and thermo-physical results analyses are presented. Finite element modeling has been used to demonstrate the positive effect of gradients on the elastic and elastic–plastic response within two different model-geometries. Partial gradients, ranging from pure tungsten to 75 vol.% tungsten, exhibit the best results and improve the expected life-time performance significantly by reducing the stresses at both interfaces, W/FGM and FGM/Cu, compared to a reference interface between W and Cu.