Application of Microchip Fabricated of Photosensitive Glass for Thermal Lens Microscopy

Application of Microchip Fabricated of Photosensitive Glass for Thermal Lens Microscopy
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光敏玻璃微芯片在热透镜显微镜中的应用

DOI:
10.1143/jjap.40.5469
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发表时间:
2001
影响因子:
1.5
通讯作者:
T. Kitamori
T. Kitamori
中科院分区:
物理与天体物理4区
文献类型:
--
作者:
T. Ito;K. Uchiyama;S. Ohya;T. Kitamori

文献摘要

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由于氟化氢(HF)对玻璃的各向同性刻蚀,传统的湿化学工艺不能成功地在玻璃晶片上实现高纵横比通道。为了获得高深宽比(宽:深:长宽比=150:250:1.67)的沟道,我们制作了光敏玻璃微芯片。采用水玻璃键合技术实现了玻璃晶片的低温键合(40-80℃)。对水玻璃键合技术的研究结果表明,在60℃去离子水中放置4h,可避免水玻璃层中钠的溶解,而在高pH条件下放置一天,则会削弱键合强度。该芯片作为一种光学化学分析方法,可以用来分析亚硝酸根的含量。虽然刻蚀后的玻璃表面粗糙度约为1微米,但热透镜显微镜的校准曲线与分光光度法的校准曲线相似。
Conventional wet chemical processes have not been successful in achieving a high aspect ratio channel on glass wafers because of isotropic etching of glass by hydrogen fluoride (HF). We fabricated a microchip of photosensitive glass in order to obtain a high aspect ratio channel (width:depth:aspect ratio = 150 µm:250 µm:1.67). The water glass bonding technique was applied to bond glass wafers at low temperature (40–80°C). The results of studying the characteristics of the water glass bonding technique for the micro total analysis system (µ-TAS) use show that dissolution of the material (sodium) from water glass layer was avoided by placing it in deionized water at 60°C for 4 h, and the bond strength was weakened by keeping it at high pH for a day. The microchip was available to analyze the amount of nitrite acid present by thermal lens microscopy as one method of optical chemical analysis. Although the etched glass surface had a roughness of about 1 µm, the calibration curve of thermal lens microscopy was similar to that of spectrophotometry.