Device-Level Vacuum Packaging for RF MEMS
Device-Level Vacuum Packaging for RF MEMS
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DOI：
10.1109/jmems.2010.2055541
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发表时间：
2010-08-01
影响因子：
2.7
通讯作者：
McBean, Ronald V.
中科院分区：
文献类型：
--
作者：
Rahman, M. Shahriar;Chitteboyina, Murali M.;McBean, Ronald V.
对于特定的射频应用来说，MEMS 的使用极具吸引力，具有成本效益的可靠封装是商业化的主要障碍之一。许多 RF MEMS 设备需要密封或真空操作环境。本文提出了一种通过在器件制造过程中生长封装层来真空封装 RF MEMS 器件的后 CMOS 兼容方法。由此产生的 MEMS 器件被真空腔包围，然后可以放置在传统的低成本电路封装中。这是一种适用于 MEMS 器件的低温、面积高效的器件级封装。采用固定配置的 RF MEMS 谐振器被用作测试台，因为它们的品质因数可用作封装质量的衡量标准。封装工艺基于双牺牲层表面微加工技术，用于在谐振器下方和上方创建空腔。使用聚酰亚胺作为牺牲层，然后沉积带有沟槽切口的封装层，这有利于牺牲层的去除。然后在低压下密封沟槽切口，在密封剂层沉积压力下在器件周围形成空腔。对封装谐振器进行了广泛的射频表征和可靠性测试。 [2009-0270]
For specific RF applications, where the use of MEMS is highly attractive, cost-effective reliable packaging is one of the primary barriers to commercialization. Many RF MEMS devices require a hermetic or vacuum operation environment. This paper presents a post-CMOS-compatible method for vacuum packaging of RF MEMS devices by growing an encapsulation layer during the device fabrication. The resulting MEMS devices are surrounded by a vacuum cavity and can then be placed in a conventional low-cost circuit package. This is a low-temperature area-efficient device-level encapsulation for MEMS devices. RF MEMS resonators in a fixed-fixed configuration were used as the test bed since their quality factor can be used as a measure of the package quality. The encapsulation process is based on a double-sacrificial-layer surface micromachining technique, which is used to create a cavity under and above the resonator. Polyimide was used as the sacrificial layer, followed by the deposition of a packaging layer with trench cuts, which facilitate the sacrificial layer removal. The trench cuts were then sealed at a low pressure, forming a cavity around the device at the sealant layer deposition pressure. Extensive RF characterization and reliability tests were performed on the packaged resonators. [2009-0270]