Crack Detection during Laser Metal Deposition by Infrared Monochrome Pyrometer.
Crack Detection during Laser Metal Deposition by Infrared Monochrome Pyrometer.
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红外单色高温计激光金属沉积过程中的裂纹检测。
DOI：
10.3390/ma13245643
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发表时间：
2020-12-10
期刊：
影响因子：
--
通讯作者：
Xiao Y
中科院分区：
文献类型：
--
作者：
Wu Y;Cui B;Xiao Y
激光金属沉积（LMD）是一种先进的增材制造技术，涉及复杂的工艺。然而，由于可能产生裂纹和气泡，它与高故障风险相关。如果不及时发现，这些缺陷可能会造成重大损失。在本文中，实时监测LMD样品和在线检测裂纹的红外单色高温计（IMP）可以减轻这种风险。研制了激光微裂纹检测实验平台，对316L奥氏体不锈钢激光微裂纹检测样品中的4条模拟裂纹进行了检测。在高于150 °C的温度下的数据由IMP收集，结果表明，裂纹深度是影响峰值温度的重要因素。根据该因子，可以确定LMD-316L奥氏体不锈钢试样中裂纹的位置。所提出的技术可以在大规模制造过程中提供通过熔覆层的裂纹的实时检测，这表明其对于优化工艺过程和参数以及减少LMD过程中裂纹的可能性的相关性。
Laser metal deposition (LMD) is an advanced technology of additive manufacturing which involves sophisticated processes. However, it is associated with high risks of failure due to the possible generation of cracks and bubbles. If not identified in time, such defects can cause substantial losses. In this paper, real-time monitoring of LMD samples and online detection of cracks by an infrared monochrome pyrometer (IMP) could mitigate this risk. An experimental platform for crack detection in LMD samples was developed, and the identification of four simulated cracks in a 316L austenitic stainless-steel LMD sample was conducted. Data at temperatures higher than 150 °C were collected by an IMP, and the results indicated that crack depth is an important factor affecting the peak temperature. Based on this factor, the locations of cracks in LMD-316L austenitic stainless-steel samples can be determined. The proposed technique can provide real-time detection of cracks through layers of cladding during large-scale manufacturing, which suggests its relevance for optimizing the technological process and parameters, as well as reducing the possibility of cracks in the LMD process.
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DOI：
10.3390/s18020609
发表时间：
2018-02-16
期刊：
Sensors (Basel, Switzerland)
影响因子：
--
作者：
Ciampa F;Mahmoodi P;Pinto F;Meo M
通讯作者：
Meo M
基于声发射和变分模态分解的金属燃烧程度在线评估
影响因子：
5.6
作者：
Gao, Zheyu;Wang, Xiufeng;Liao, Yuhe
通讯作者：
Liao, Yuhe
影响因子：
5.4
作者：
Jiao, Yubo;Fu, Liuxu;Liu, Shiqi
通讯作者：
Liu, Shiqi
影响因子：
3.4
作者：
Juraszek, Janusz
通讯作者：
Juraszek, Janusz
影响因子：
1.3
作者：
Cho, Y., I;Shin, S. H.;Kim, J. H.
通讯作者：
Kim, J. H.