Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy
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DOI：
10.1016/j.microrel.2012.07.029
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发表时间：
2013-01-01
影响因子：
1.6
通讯作者：
Chen, Chih
中科院分区：
文献类型：
--
作者：
Tu, K. N.;Hsiao, Hsiang-Yao;Chen, Chih
随着微电子工业在硅通孔（TSV）技术的基础上发展三维集成电路，用于互连堆叠芯片的微凸点的工艺和可靠性正受到积极的研究。由于微凸点尺寸减小，直径比倒装芯片焊点小约一个数量级，体积小1000倍。由于微凸块中的晶粒数量变得非常少，因此其微结构以及其性能将是各向异性的。由于各向异性的存在，其统计破坏将具有较宽的分布，包括早期破坏。本次审查讨论了这个问题和补救措施。(C)2012爱思唯尔有限公司保留所有权利。
As microelectronic industry develops 3D IC on the basis of through-Si-vias (TSV) technology, the processing and reliability of microbumps, which are used to interconnect the stacking chips, is being actively investigated. Due to the reduction in size of microbumps, the diameter is about one order of magnitude smaller than that of flip chip solder joints, and the volume is 1000 times smaller. Its microstructure and in turn its properties will be anisotropic because the number of grains in a microbump becomes very small. Its statistical failure will have a wide distribution because of anisotropy, including early failure. This review addresses this issue and the remedy. (C) 2012 Elsevier Ltd. All rights reserved.