Effect of processing conditions on the bonding quality of FDM polymer filaments
Effect of processing conditions on the bonding quality of FDM polymer filaments
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DOI：
10.1108/13552540810862028
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发表时间：
2008-01-01
影响因子：
3.9
通讯作者：
Gu, P.
中科院分区：
文献类型：
--
作者：
Sun, Q.;Rizvi, G. M.;Gu, P.
目的-本文的目的是研究熔融沉积成型（FDM）过程中挤出聚合物长丝之间的粘合形成的控制机制。粘合现象是热驱动的，并最终决定了所得prototypes.Design/方法/approach的完整性和机械性能-通过测量和分析的介观结构的变化和愈合的程度在相邻的聚合物长丝之间的接口进行了评估的债券质量。实验测量了不同工艺条件下制备的试样的温度分布，观察了其对细观结构和力学性能的影响。平行的实验工作，预测的粘合程度在长丝沉积过程中实现的热分析的基础上挤出的聚合物filaments.Findings -实验结果表明，制造策略，信封温度和对流系数的变化有很强的影响上的冷却温度曲线，以及丝之间的粘结强度的介观结构和整体质量。烧结现象被发现有一个显着的影响键的形成，但只有在很短的时间内，当长丝的温度高于临界烧结温度。否则，蠕变变形被发现占主导地位的mesostructure. Origality/值的变化-这项研究提供了宝贵的信息沉积策略和加工条件的影响内FDM原型的介观结构和局部机械性能。它也带来了更好的理解现象控制FDM产品的完整性。这些知识对于制造功能部件和使该工艺的应用范围多样化至关重要。研究结果是特别相关的工作进行建模的过程中，并制定新的材料的FDM过程。
Purpose - The purpose of this paper is to investigate the mechanisms controlling the bond formation among extruded polymer filaments in the fused deposition modeling (FDM) process. The bonding phenomenon is thermally driven and ultimately determines the integrity and mechanical properties of the resultant prototypes.Design/methodology/approach - The bond quality was assessed through measuring and analyzing changes in the mesostructure and the degree of healing achieved at the interfaces between the adjoining polymer filaments. Experimental measurements of the temperature profiles were carried out for specimens produced under different processing conditions, and the effects on mesostructures and mechanical properties were observed. Parallel to the experimental work, predictions of the degree of bonding achieved during the filament deposition process were made based on the thermal analysis of extruded polymer filaments.Findings - Experimental results showed that the fabrication strategy, the envelope temperature and variations in the convection coefficient had strong effects on the cooling temperature profile, as well as on the mesostructure and overall quality of the bond strength between filaments. The sintering phenomenon was found to have a significant effect on bond formation, but only for the very short duration when the filament's temperature was above the critical sintering temperature. Otherwise, creep deformation was found to dominate changes in the mesostructure.Originality/value - This study provides valuable information about the effect of deposition strategies and processing conditions on the mesostructure and local mechanical properties within FDM prototypes. It also brings a better understanding of phenomena controlling the integrity of FDM products. Such knowledge is essential for manufacturing functional parts and diversifying the range of application of this process. The findings are particularly relevant to work conducted on modeling of the process and for the formulation of materials new to the FDM process.