Weaving integrated circuits into textiles
Weaving integrated circuits into textiles
复制标题
将集成电路编织成纺织品
DOI：
10.1109/iswc.2010.5665874
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发表时间：
2010
期刊：
影响因子：
--
通讯作者：
G. Tröster
中科院分区：
文献类型：
--
作者：
C. Zysset;K. Cherenack;T. Kinkeldei;G. Tröster
我们提出并展示了一种在机织纺织品的纱线层面集成电子功能的技术。该技术原理符合商业织造工艺，适用于大规模生产。对薄膜器件、互连线和接触垫进行图案化处理，并将硅基集成电路附着在柔性塑料基板上。将基板切割成电子纤维（e - 纤维），然后使用商业织机将其织入智能纺织品中。导电纺织线将电子纤维相互连接，在纺织品中形成总线结构。我们通过一种机织纺织品展示了该技术，这种纺织品包含5根传感器电子纤维，共有10个温度传感器集成电路连接到总线拓扑结构。这种纺织品集成方法使得智能纺织品在保持诸如悬垂性等基本纺织品特性的同时，具有良好的机械强度。这种机织纺织品被用作内衣的一部分，用于监测皮肤和衣物层之间的温度，以预测中暑和体温过低。该演示只是这种智能纺织品技术可实现的众多可穿戴计算应用中的一个。
We present and demonstrate a technology for integrating electronic functionality at the yarn level of woven textiles. The technology principles are compliant with commercial weaving processes and suitable for large scale manufacturing. Thin-film devices, interconnect lines and contact pads are patterned and silicon-based integrated circuits are attached to flexible plastic substrates. The substrates are cut into electronic fibers (e-fibers), which are woven into smart textiles using a commercial weaving machine. Conductive textile threads interconnect the e-fibers among each other, forming a bus structure in the textile. We demonstrate the technology with a woven textile incorporating 5 sensor e-fibers with a total of 10 temperature sensor-ICs connected to a bus topology. This textile integration method results in smart textiles that are mechanically robust while maintaining essential textile properties such as drapability. The woven textile is used as a part of an undershirt to monitor the temperature between skin and clothing layers to predict heat stroke and undercooling. The demonstrator is only one of many wearable computing applications that can be enabled with this smart textile technology.