Horizontal and vertical integration of product data for the design of moulded interconnect devices
Horizontal and vertical integration of product data for the design of moulded interconnect devices
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DOI：
10.1080/09511920902741091
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发表时间：
2009-10
影响因子：
4.1
通讯作者：
Yong Zhuo;C. Alvarez;K. Feldmann
中科院分区：
文献类型：
--
作者：
Yong Zhuo;C. Alvarez;K. Feldmann
本文提出了一种适合模压互连器件（3D-MID）需要的产品数据纵向和横向集成方法。为此，提出了一种基于STEP标准和特征技术的集成产品模型.利用STEP AP 210的应用对象和模式，对STEP AP 210进行扩展，以支持电子设计和机械设计之间的横向协作。特别注意的是，电路载体的三维结构的描述和运行在它和它的表面上的电路迹线。此外，集成产品模型还支持上游MID设计与下游仿真制造之间的层次化协作。基于该产品模型，可以在MIDCAD中的MID设计与MOLDFLOW中的注塑成型过程仿真和利用MID专用自动放置设备的制造之间建立有效的通信。
In this paper, a methodology for the vertical and the horizontal integration of product data fitted to the needs of Moulded Interconnect Devices (3D-MID) is presented. For that purpose, an integrated product model based on STEP and the feature technology is developed. The application objects and schemas of STEP AP210 are used and extended to support the horizontal collaboration between electronic and mechanical design. Special attention is paid to the description of the three-dimensional structure of the circuit carrier and the circuit traces running within it and on its surface. In addition, the integrated product model also supports the hierarchical collaboration between upstream MID design and downstream simulation and manufacturing. Based on this product model, an effective communication between MID design in MIDCAD and the simulation of the injection moulding process in MOLDFLOW and manufacturing utilising MID-specific automatic placement equipment could be established.