Computed Tomography-Based Characterization of the Fatigue Behavior and Damage Development of Extruded Profiles Made from Recycled AW6060 Aluminum Chips
Computed Tomography-Based Characterization of the Fatigue Behavior and Damage Development of Extruded Profiles Made from Recycled AW6060 Aluminum Chips
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DOI：
10.3390/ma12152372
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发表时间：
2019-08-01
期刊：
影响因子：
3.4
通讯作者：
Walther, Frank
中科院分区：
文献类型：
--
作者：
Koch, Alexander;Wittke, Philipp;Walther, Frank
通过热挤压铝屑（通常被认为是废料）直接生产型材的可能性是能源密集型重熔工艺的一种有前途的替代方法。必须考虑的是，机械性能取决于挤出过程中出现的芯片之间的焊缝质量。为了估计焊缝的影响，准静态和循环的调查进行芯片为基础的型材，并最终与铸造为基础的挤压型材进行比较。为了获得有关疲劳进程的全面信息，在疲劳试验期间使用了不同的测量技术，如交流电位降（ACPD）技术、滞后测量和温度测量。采用计算机断层扫描和金相技术对焊缝和空洞进行了研究。结果表明，准静态性能的芯片为基础的标本只减少了约5%，而寿命减少了约十年。疲劳裂纹的发展，芯片之间的边界传播，其特征在于由一个间歇性的测试策略，其中两个独立的裂纹的起始观察。
The possibility of producing profiles directly by hot extrusion of aluminum chips, normally considered as scrap, is a promising alternative to the energy-intensive remelting process. It has to be taken into account that the mechanical properties depend on the quality of the weld seams between the chips, which arise during the extrusion process. To estimate the influence of the weld seams, quasistatic and cyclic investigations were performed on chip-based profiles and finally compared with cast-based extruded profiles. In order to gain comprehensive information about the fatigue progress, different measurement techniques like alternating current potential drop (ACPD)-technique, hysteresis measurements, and temperature measurements were used during the fatigue tests. The weld seams and voids were investigated using computed tomography and metallographic techniques. Results show that quasistatic properties of chip-based specimens are only reduced by about 5%, whereas the lifetime is reduced by about a decade. The development of the fatigue cracks, which propagate between the chip boundaries, was characterized by an intermittent testing strategy, where an initiation of two separate cracks was observed.