Echidna: the engineering challenges
Echidna: the engineering challenges
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针鼹：工程挑战
DOI：
10.1117/12.550963
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发表时间：
2004
期刊：
影响因子：
--
通讯作者：
Greg A. Smith
中科院分区：
文献类型：
--
作者：
J. Brzeski;P. Gillingham;David Correll;J. Dawson;A. Moore;R. Muller;S. Smedley;Greg A. Smith
英澳天文台（AAO）的FMOS-Echidna项目是斯巴鲁望远镜的光纤多目标光谱系统。它包括三个部分：400光纤定位系统，焦平面成像仪（FPI）和主聚焦校正器。Echidna定位器的概念和AAO在FMOS项目中的作用已经在以前的SPIE会议记录中描述过。在原型测试表明将达到所需性能后，目前正在制造该系统的许多部件。在本文中，开发的技术，以克服关键的机械和电子工程的定位器和FPI的挑战。主要性能要求是所有400个科学光纤芯和多达14个导向光纤束将在10分钟内重新定位到10μm的精度。对于快速的主焦点焦比，还必须保持光纤尖端的轴向位置上的紧密公差，使得效率不会受到散焦的影响。定位精度由FPI控制，FPI可测量光纤尖端的位置，精度可达几μm，并允许重复定位。保持光纤尖端充分共面需要在组装导致这种误差的几个部件时进行精确控制。装配夹具已被开发出来，并证明足以满足此目的。要在装配中实现高可靠性，包括压电陶瓷、碳纤维增强塑料、硬化钢和电路板在内的许多不同材料的小部件粘合在一起，需要仔细选择和应用粘合剂以及严格控制的电气连接焊接。
The Anglo-Australian Observatory's (AAO's) FMOS-Echidna project is for the Fiber Multi-Object Spectroscopy system for the Subaru Telescope. It includes three parts: the 400-fiber positioning system, the focal plane imager (FPI) and the prime focus corrector. The Echidna positioner concept and the role of the AAO in the FMOS project have been described in previous SPIE proceedings. The many components for the system are now being manufactured, after prototype tests have demonstrated that the required performance will be achieved. In this paper, the techniques developed to overcome key mechanical and electronic engineering challenges for the positioner and the FPI are described. The major performance requirement is that all 400 science fiber cores and up to 14 guide fiber bundles are to be re-positioned to an accuracy of 10μm within 10 minutes. With the fast prime focus focal ratio, a close tolerance on the axial position of the fiber tips must also be held so efficiency does not suffer from de-focus. Positioning accuracy is controlled with the help of the FPI, which measures the positions of the fiber tips to an accuracy of a few μm and allows iterative positioning. Maintaining fiber tips sufficiently co-planar requires accurate control in the assembly of the several components that contribute to such errors. Assembly jigs have been developed and proven adequate for this purpose. Attaining high reliability in an assembly with many small components of disparate materials bonded together, including piezo ceramics, carbon fiber reinforced plastic, hardened steel, and electrical circuit boards, has entailed careful selection and application of cements and tightly controlled soldering for electrical connections.