A HARPSS polysilicon vibrating ring gyroscope
A HARPSS polysilicon vibrating ring gyroscope
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DOI：
10.1109/84.925732
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发表时间：
2001-06-01
影响因子：
2.7
通讯作者：
Najafi, K
中科院分区：
文献类型：
--
作者：
Ayazi, F;Najafi, K
本文介绍了一种80 μ m厚、直径1.1mm的高深宽比（20：1）多晶硅环形陀螺的设计、制造和测试。采用高纵横比的多晶硅和单晶硅组合MEMS技术（HARPSS）制作了振动环陀螺，这种全硅单晶片技术能够制作出高达50 ~ 100 μ m的垂直电极，其气隙尺寸从亚微米到几十微米不等。对振动环陀螺仪的灵敏度进行了详细的分析，确定了陀螺仪的标度极限。在低真空水平下测量了在+/-250 deg/s的动态范围内200 μ V/deg/s的开环灵敏度，用于以混合格式测试的原型器件。品质因子（Q）为1200、驱动幅度为0.15 μ m、感测节点寄生电容为2 pF的PRG的分辨率经测量在1 Hz带宽内小于1 °/s，受到电路噪声的限制。寄生电容的消除和环形结构的品质因数的改善预期将分辨率降低到0.01 deg/s/（Hz）（0.5）。
This paper presents the design, fabrication, and testing of an 80-mum-thick, 1.1 mm in diameter high aspect-ratio (20:1) polysilicon ring gyroscope (PRG). The vibrating ring gyroscope was fabricated through the high aspect-ratio combined poly and single-crystal silicon MEMS technology (HARPSS), This all-silicon single-wafer technology is capable of producing electrically isolated vertical electrodes as tall as the main body structure 50 to 100's (mum tall) with various size air-gaps ranging from submicron to tens of microns. A detailed analysis has been performed to determine the overall sensitivity of the vibrating ring gyroscope and identify its scaling limits. An open-loop sensitivity of 200 muV/deg/s in a dynamic range of +/- 250 deg/s was measured under low vacuum level for a prototype device tested in hybrid format. The resolution for a PRG with a quality factor (Q) of 1200, drive amplitude of 0.15 mum, and sense node parasitic capacitances of 2 pF was measured to be less than 1 deg/s in 1 Hz bandwidth, limited by the noise from the circuitry. Elimination of the parasitic capacitances and improvement in the quality factor of the ring structure are expected to reduce the resolution to 0.01 deg/s/(Hz)(0.5).